Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4726859 | Wire for bonding a semiconductor device | Naoyuki Hosoda, Naoki Uchiyama, Toshiaki Ono | 1988-02-23 |
| 4512950 | Lead alloy soft solder containing radioactive particles used to make more reliable semiconductor devices | Naoyuki Hosoda, Naoki Uchiyama | 1985-04-23 |