Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10468370 | Bonding wire for semiconductor device | Takashi Yamada, Ryo OISHI, Tomohiro Uno | 2019-11-05 |
| 10414002 | Bonding wire for semiconductor device | Takashi Yamada, Teruo Haibara, Ryo OISHI, Kazuyuki Saito, Tomohiro Uno | 2019-09-17 |
| 10381320 | Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmium | Tetsuya OYAMADA, Tomohiro Uno, Hiroyuki Deai | 2019-08-13 |
| 10236272 | Cu alloy core bonding wire with Pd coating for semiconductor device | Takashi Yamada, Teruo Haibara, Tomohiro Uno | 2019-03-19 |
| 10137534 | Bonding wire for semiconductor device | Takashi Yamada, Teruo Haibara, Ryo OISHI, Kazuyuki Saito, Tomohiro Uno | 2018-11-27 |
| 10121758 | Bonding wire for semiconductor device | Motoki ETO, Kazuyuki Saito, Teruo Haibara, Ryo OISHI, Takashi Yamada +1 more | 2018-11-06 |
| 10032741 | Bonding wire for semiconductor device | Motoki ETO, Takashi Yamada, Teruo Haibara, Ryo OISHI, Tomohiro Uno +1 more | 2018-07-24 |
| 9887172 | Bonding wire for semiconductor device | Motoki ETO, Kazuyuki Saito, Teruo Haibara, Ryo OISHI, Takashi Yamada +1 more | 2018-02-06 |
| 9812421 | Bonding wire for semiconductor devices | Tomohiro Uno, Yoshiaki Hagiwara, Tetsuya OYAMADA | 2017-11-07 |
| 9773748 | Bonding wire for semiconductor device | Takashi Yamada, Ryo OISHI, Tomohiro Uno | 2017-09-26 |
| 9543266 | Bonding wire for semiconductor device use and method of production of same | Takashi Yamada, Ryo OISHI, Teruo Haibara, Tomohiro Uno | 2017-01-10 |
| 9536854 | Bonding wire for semiconductor device use and method of production of same | Takashi Yamada, Ryo OISHI, Teruo Haibara, Tomohiro Uno | 2017-01-03 |
| 9427830 | Copper alloy bonding wire for semiconductor | Tomohiro Uno, Shinichi Terashima, Takashi Yamada | 2016-08-30 |
| 9059003 | Power semiconductor device, method of manufacturing the device and bonding wire | Kohei Tatsumi, Takashi Yamada | 2015-06-16 |
| 8815019 | Bonding wire for semiconductor | Tomohiro Uno, Shinichi Terashima, Takashi Yamada, Ryo OISHI | 2014-08-26 |
| 8742258 | Bonding wire for semiconductor | Shinichi Terashima, Tomohiro Uno, Takashi Yamada | 2014-06-03 |
| 8097960 | Semiconductor mounting bonding wire | Shinichi Terashima, Tomohiro Uno, Kohei Tatsumi, Takashi Yamada, Atsuo Ikeda | 2012-01-17 |