Issued Patents All Time
Showing 51–64 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5111276 | Thick bus metallization interconnect structure to reduce bus area | Hemraj K. Hingarh, Andres D. Asuncion, Robert L. Brown | 1992-05-05 |
| 5111355 | High value tantalum oxide capacitor | Kranti V. Anand | 1992-05-05 |
| 5091048 | Ion milling to obtain planarization | — | 1992-02-25 |
| 5051690 | Apparatus and method for detecting vertically propagated defects in integrated circuits | Wojciech P. Maly | 1991-09-24 |
| 5000818 | Method of fabricating a high performance interconnect system for an integrated circuit | Jeffrey D. Chinn | 1991-03-19 |
| 4933743 | High performance interconnect system for an integrated circuit | Jeffrey D. Chinn | 1990-06-12 |
| 4920071 | High temperature interconnect system for an integrated circuit | — | 1990-04-24 |
| 4873794 | Holder for milling countersink filler plugs | Jeffrey L. Shurtliff | 1989-10-17 |
| 4835466 | Apparatus and method for detecting spot defects in integrated circuits | Wojciech P. Maly | 1989-05-30 |
| 4829363 | Structure for inhibiting dopant out-diffusion | Madhukar B. Vora, Ashok K. Kapoor | 1989-05-09 |
| 4670091 | Process for forming vias on integrated circuits | Robert L. Brown | 1987-06-02 |
| 4640004 | Method and structure for inhibiting dopant out-diffusion | Madhukar B. Vora, Ashok K. Kapoor | 1987-02-03 |
| 4563362 | Meat analog having a protein-gum-starch matrix | Rita W. Brander, Teresa A. Raap, Marshall M. Rankowitz | 1986-01-07 |
| 4489482 | Impregnation of aluminum interconnects with copper | Thomas Keyser, John M. Pierce, James M. Cleeves | 1984-12-25 |