Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5111276 | Thick bus metallization interconnect structure to reduce bus area | Hemraj K. Hingarh, Michael E. Thomas, Robert L. Brown | 1992-05-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5111276 | Thick bus metallization interconnect structure to reduce bus area | Hemraj K. Hingarh, Michael E. Thomas, Robert L. Brown | 1992-05-05 |