VT

Victor Tan

Microsoft: 18 patents #2,017 of 40,388Top 5%
Micron: 14 patents #1,151 of 6,345Top 20%
CM Chartered Semiconductor Manufacturing: 1 patents #419 of 840Top 50%
GP Globalfoundries Singapore Pte.: 1 patents #427 of 828Top 55%
📍 Singapore, WA: #3 of 38 inventorsTop 8%
Overall (All Time): #92,475 of 4,157,543Top 3%
36
Patents All Time

Issued Patents All Time

Showing 26–36 of 36 patents

Patent #TitleCo-InventorsDate
7332820 Stacked die in die BGA package Hock Chuan Tan, Thiam Chye Lim, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more 2008-02-19
7309623 Method of fabricating a stacked die in die BGA package Hock Chuan Tan, Thiam Chye Lim, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more 2007-12-18
7302488 Parental controls customization and notification Ashvin J. Mathew, Craig Beilinson, Christopher A. Evans, Harry Fravert, Ahmad Safa +2 more 2007-11-27
7282390 Stacked die-in-die BGA package with die having a recess Hock Chuan Tan, Thiam Chye Lim, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more 2007-10-16
7282392 Method of fabricating a stacked die in die BGA package Hock Chuan Tan, Thiam Chye Lim, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more 2007-10-16
7213054 Methods and apparatuses for handling single-user applications in multi-user computing environments Christopher A. Evans, Giampiero M. Sierra, Sterling Reasor, Frank Yerrace, Louis Amadio +1 more 2007-05-01
7127719 Methods and arrangements for providing multiple concurrent desktops and workspaces in a shared computing environment Christopher A. Evans, Giampiero M. Sierra, Praerit Garg, David A. Matthews, Reiner Fink +1 more 2006-10-24
7112048 BOC BGA package for die with I-shaped bond pad layout Thiam Chye Lim, Kay Kit Tan, Kian Lee, Kwang Hong Tan, Chong Pei Andrew Lim +4 more 2006-09-26
6807666 Methods and arrangements for providing multiple concurrent desktops and workspaces in a shared computing environment Christopher A. Evans, Giampiero M. Sierra, Praerit Garg, David A. Matthews, Reiner Fink +1 more 2004-10-19
6720666 BOC BGA package for die with I-shaped bond pad layout Thiam Chye Lim, Kay Kit Tan, Kian Lee, Kwang Hong Tan, Chong Pei Andrew Lim +4 more 2004-04-13
6692987 BOC BGA package for die with I-shaped bond pad layout Thiam Chye Lim, Kay Kit Tan, Kian Lee, Kwang Hong Tan, Chong Pei Andrew Lim +4 more 2004-02-17