Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
PB

Pete Benson — 7 Patents

Micron: 6 patents #2,268 of 6,374Top 40%
Boise, ID: #1,007 of 3,546 inventorsTop 30%
Idaho: #1,702 of 8,810 inventorsTop 20%
Overall (All Time): #680,018 of 4,157,543Top 20%
7 Patents All Time
Pete Benson has been granted 7 US patents while listed as an inventor at Micron. The first was granted in 2005 and the most recent in December 2014. Pete Benson ranks #680,018 of 4,157,543 US inventors in our database (top 16.4%). Patent records list Pete Benson in Boise, ID, US.

Patents per Year

Patents granted per year, 2005 to 2014Bar chart with a peak of 2 patents in 2006.peak 22005: 1 patents20052006: 2 patents20062007: 1 patents20072008: 1 patents20082009: 1 patents20092014: 1 patents2014

Issued Patents All Time

Showing 1–7 of 7 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
8924274 For and method of providing portfolio risk information to investors without revealing position information Brian Schmid, Gregg E Berman 2014-12-30
7498675 Semiconductor component having plate, stacked dice and conductive vias Warren M. Farnworth, Alan G. Wood, William M. Hiatt, James M. Wark, David R. Hembree +1 more 2009-03-03 $1,946,000
7459393 Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contacts Warren M. Farnworth, Alan G. Wood, William M. Hiatt, James M. Wark, David R. Hembree +1 more 2008-12-02 $734,000
7224051 Semiconductor component having plate and stacked dice Warren M. Farnworth, Alan G. Wood, William M. Hiatt, James M. Wark, David R. Hembree +1 more 2007-05-29 $2,522,000
7060526 Wafer level methods for fabricating multi-dice chip scale semiconductor components Warren M. Farnworth, Alan G. Wood, William M. Hiatt, James M. Wark, David R. Hembree +1 more 2006-06-13 $2,576,000
6998717 Multi-dice chip scale semiconductor components Warren M. Farnworth, Alan G. Wood, William M. Hiatt, James M. Wark, David R. Hembree +1 more 2006-02-14 $2,198,000
6841883 Multi-dice chip scale semiconductor components and wafer level methods of fabrication Warren M. Farnworth, Alan G. Wood, William M. Hiatt, James M. Wark, David R. Hembree +1 more 2005-01-11 $1,663,000