Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12063874 | Electrical, mechanical, computing, and/or other devices formed of extremely low resistance materials | Douglas J. Gilbert, Y. Eugene Shteyn, Michael James Smith, Joel Patrick Hanna, Paul Greenland +1 more | 2024-08-13 |
| 11935756 | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same | Baosuo Zhou, Mirzafer Abatchev, Ardavan Niroomand, Paul A. Morgan, Shuang Meng +1 more | 2024-03-19 |
| 11335563 | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same | Baosuo Zhou, Mirzafer Abatchev, Ardavan Niroomand, Paul A. Morgan, Shuang Meng +1 more | 2022-05-17 |
| 11289639 | Electrical, mechanical, computing, and/or other devices formed of extremely low resistance materials | Douglas J. Gilbert, Y. Eugene Shteyn, Michael James Smith, Joel Patrick Hanna, Paul Greenland +1 more | 2022-03-29 |
| 11273469 | Controlling dry etch process characteristics using waferless dry clean optical emission spectroscopy | Deepak Vedhachalam, Francois C. Dassapa | 2022-03-15 |
| 10773282 | Controlling dry etch process characteristics using waferless dry clean optical emission spectroscopy | Deepak Vedhachalam, Francois C. Dassapa | 2020-09-15 |
| 10607844 | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same | Baosuo Zhou, Mirzafer Abatchev, Ardavan Niroomand, Paul A. Morgan, Shuang Meng +1 more | 2020-03-31 |
| 10446453 | Surface modification control for etch metric enhancement | Viswas Purohit, Seiichi Watanabe, Kenji Komatsu | 2019-10-15 |
| 10333047 | Electrical, mechanical, computing/ and/or other devices formed of extremely low resistance materials | Douglas J. Gilbert, Y. Eugene Shteyn, Michael James Smith, Joel Patrick Hanna, Paul Greenland +1 more | 2019-06-25 |
| 10304668 | Localized process control using a plasma system | Vaidya Bharadwaj | 2019-05-28 |
| 10096483 | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same | Baosuo Zhou, Mirzafer Abatchev, Ardavan Niroomand, Paul A. Morgan, Shuang Meng +1 more | 2018-10-09 |
| 9761457 | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same | Baosuo Zhou, Mirzafer Abatchev, Ardavan Niroomand, Paul A. Morgan, Shuang Meng +1 more | 2017-09-12 |
| 9305782 | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same | Baosuo Zhou, Mirzafer Abatchev, Ardavan Niroomand, Paul A. Morgan, Shuang Meng +1 more | 2016-04-05 |
| 8852851 | Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same | Baosuo Zhou, Mirzafer Abatchev, Ardavan Niroomand, Paul A. Morgan, Shuang Meng +1 more | 2014-10-07 |
| 8129289 | Method to deposit conformal low temperature SiO2 | John Smythe, Gurtej S. Sandhu, Shyam Surthi, Shuang Meng | 2012-03-06 |