Issued Patents All Time
Showing 26–48 of 48 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9882075 | Light sensor with vertical diode junctions | Nicole D. Kerness, Christopher F. Edwards, Khanh Tran, Joy T. Jones | 2018-01-30 |
| 9846083 | Ambient temperature measurement sensor | Arvin Emadi, Abhishek Sahasrabudhe, Cheng-Wei Pei | 2017-12-19 |
| 9704809 | Fan-out and heterogeneous packaging of electronic components | Khanh Tran, Arkadii V. Samoilov, Amit S. Kelkar | 2017-07-11 |
| 9632964 | Communications control system with a serial communications interface and a parallel communications interface | James G. Calvin, Albert Rooyakkers | 2017-04-25 |
| 9608635 | Digital input circuit and method for high voltage sensors | Anthony Partow | 2017-03-28 |
| 9557228 | Ambient temperature measurement | — | 2017-01-31 |
| 9502356 | Device and method with physical unclonable function | — | 2016-11-22 |
| 9485094 | Systems and methods for stable physically unclonable functions | Sung Ung Kwak | 2016-11-01 |
| 9465762 | Communications control system with a serial communications interface and a parallel communications interface | James G. Calvin, Albert Rooyakkers | 2016-10-11 |
| 9459833 | System and method with specific ordered execution over physical elements | Sung Ung Kwak, Donald W. Loomis, Edward Ma, Robert Michael Muchsel | 2016-10-04 |
| 9343426 | Use of device assembly for a generalization of three-dimensional metal interconnect technologies | — | 2016-05-17 |
| 9294063 | Digital input circuit and method for high voltage sensors | Anthony Partow | 2016-03-22 |
| 9239254 | Ambient temperature measurement | — | 2016-01-19 |
| 9230903 | Multi-die, high current wafer level package | Arkadii V. Samoilov, Peter R. Harper, Viren Khandekar | 2016-01-05 |
| 9229581 | Method for detecting gestures using a multi-segment photodiode and one or fewer illumination sources | David Skurnik, Nevzat Akin Kestelli, Ilya K. Veygman, Anand Chamakura, Christopher F. Edwards +2 more | 2016-01-05 |
| 9087779 | Multi-die, high current wafer level package | Arkadii V. Samoilov, Peter R. Harper, Viren Khandekar | 2015-07-21 |
| 8906720 | Device having an optical element and an ambient light sensor integrated on a single substrate and a process for making same | Christopher F. Edwards, Joy T. Jones | 2014-12-09 |
| 8868813 | Communications control system with a serial communications interface and a parallel communications interface | James G. Calvin, Albert Rooyakkers | 2014-10-21 |
| 8716649 | Optical gesture sensor using a single illumination source | David Skurnik, Nevzat Akin Kestelli, Ilya K. Veygman, Anand Chamakura, Christopher F. Edwards +2 more | 2014-05-06 |
| 8686560 | Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress | Reynante Tamunan Alvarado, Chiung C. Lo, Arkadii V. Samoilov | 2014-04-01 |
| 8349653 | Use of device assembly for a generalization of three-dimensional metal interconnect technologies | — | 2013-01-08 |
| 5988819 | Single output transistor output stage for interface applications | Sui Ping Shieh, David Bingham | 1999-11-23 |
| 5666082 | Fault protection using parallel output CMOS devices for integrated circuit analog switches | Richard Wilenken, Terry Martin | 1997-09-09 |