EF

Eugene A. Fitzgerald

MIT: 53 patents #26 of 9,367Top 1%
AS Amberwave Systems: 41 patents #2 of 20Top 10%
TSMC: 24 patents #1,420 of 12,232Top 15%
NU Nanyang Technological University: 10 patents #9 of 1,285Top 1%
AT AT&T: 5 patents #3,608 of 18,772Top 20%
NS National University Of Singapore: 4 patents #72 of 1,623Top 5%
CF Cornell Research Foundation: 2 patents #418 of 1,638Top 30%
DL Draper Laboratory: 1 patents #495 of 921Top 55%
📍 Windham, NH: #1 of 335 inventorsTop 1%
🗺 New Hampshire: #22 of 12,181 inventorsTop 1%
Overall (All Time): #8,528 of 4,157,543Top 1%
129
Patents All Time

Issued Patents All Time

Showing 51–75 of 129 patents

Patent #TitleCo-InventorsDate
7588994 Methods for forming strained-semiconductor-on-insulator device structures by mechanically inducing strain Thomas A. Langdo, Matthew T. Currie, Richard Hammond, Anthony J. Lochtefeld 2009-09-15
7566606 Methods of fabricating semiconductor devices having strained dual channel layers Matthew T. Currie, Anthony J. Lochtefeld, Christopher Leitz 2009-07-28
7535089 Monolithically integrated light emitting devices 2009-05-19
7501351 Relaxed SiGe platform for high speed CMOS electronics and high speed analog circuits 2009-03-10
7495266 Strained silicon-on-silicon by wafer bonding and layer transfer David Isaacson 2009-02-24
7465619 Methods of fabricating dual layer semiconductor devices 2008-12-16
7420201 Strained-semiconductor-on-insulator device structures with elevated source/drain regions Thomas A. Langdo, Matthew T. Currie, Richard Hammond, Anthony J. Lochtefeld 2008-09-02
7414259 Strained germanium-on-insulator device structures Thomas A. Langdo, Matthew T. Currie, Richard Hammond, Anthony J. Lochtefeld 2008-08-19
7390701 Method of forming a digitalized semiconductor structure Zhiyuan Cheng, Dimitri Antoniadis 2008-06-24
7348259 Method of fabricating a semiconductor structure that includes transferring one or more material layers to a substrate and smoothing an exposed surface of at least one of the material layers Zhiyuan Cheng, Dimitri Antoniadis 2008-03-25
7304336 FinFET structure and method to make the same Zhiyuan Cheng, Dimitri Antoniadis 2007-12-04
7301180 Structure and method for a high-speed semiconductor device having a Ge channel layer Minjoo L. Lee, Christopher Leitz 2007-11-27
7297612 Methods for forming strained-semiconductor-on-insulator device structures by use of cleave planes Thomas A. Langdo, Matthew T. Currie, Richard Hammond, Anthony J. Lochtefeld 2007-11-20
7259388 Strained-semiconductor-on-insulator device structures Thomas A. Langdo, Matthew T. Currie, Richard Hammond, Anthony J. Lochtefeld 2007-08-21
7259108 Methods for fabricating strained layers on semiconductor substrates Matthew T. Currie 2007-08-21
7256142 Relaxed SiGe platform for high speed CMOS electronics and high speed analog circuits 2007-08-14
7250359 Controlling threading dislocation densities in Ge on Si using graded GeSi layers and planarization 2007-07-31
7227176 Etch stop layer system Kenneth Chai-en Wu, Gianni Taraschi, Jeffrey T. Borenstein 2007-06-05
7217668 Gate technology for strained surface channel and strained buried channel MOSFET devices Richard Hammond, Matthew T. Currie 2007-05-15
7202124 Strained gettering layers for semiconductor processes Arthur J. Pitera 2007-04-10
7180648 Electro-absorption modulator device and methods for fabricating the same Carl Dohrman, Saurabh Gupta 2007-02-20
7141820 Structures with planar strained layers Minjoo L. Lee, Christopher Leitz 2006-11-28
7138310 Semiconductor devices having strained dual channel layers Matthew T. Currie, Anthony J. Lochtefeld, Christopher Leitz 2006-11-21
7138649 Dual-channel CMOS transistors with differentially strained channels Matthew T. Currie, Anthony J. Lochtefeld 2006-11-21
7109516 Strained-semiconductor-on-insulator finFET device structures Thomas A. Langdo, Matthew T. Currie, Glyn Braithwaite, Richard Hammond, Anthony J. Lochtefeld 2006-09-19