Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11894261 | Silicon-on-insulator substrate including trap-rich layer and methods for making thereof | Ron Bowman | 2024-02-06 |
| 11145537 | Silicon-on-insulator substrate including trap-rich layer and methods for making thereof | Ron Bowman | 2021-10-12 |
| 10323504 | Techniques for determining an angular offset between two objects | Brian Ross Gollehon | 2019-06-18 |
| 7781311 | System and method for filling vias | Georgina Marie Jabbour, James C. Baker | 2010-08-24 |
| 7262900 | Utilizing a protective plug to maintain the integrity of the FTP shrink hinge | Anthony DiCarlo, Rabah Mezenner, James C. Baker, George Harakas | 2007-08-28 |
| 6780759 | Method for multi-frequency bonding | Shari Farrens, William J. Franklin, Wei-Nan LIU | 2004-08-24 |
| 6062163 | Plasma initiating assembly | Roger Patrick, Philippe Schoenborn, Frank Bose | 2000-05-16 |
| 5639519 | Method for igniting low pressure inductively coupled plasma | Roger Patrick, Philippe Schoenborn, Frank Bose | 1997-06-17 |
| 5624304 | Techniques for assembling polishing pads for chemi-mechanical polishing of silicon wafers | Nicholas F. Pasch, Thomas G. Mallon | 1997-04-29 |
| 5516400 | Techniques for assembling polishing pads for chemical-mechanical polishing of silicon wafers | Nicholas F. Pasch, Thomas G. Mallon | 1996-05-14 |
| 5468296 | Apparatus for igniting low pressure inductively coupled plasma | Roger Patrick, Philippe Schoenborn, Frank Bose | 1995-11-21 |
| 5310455 | Techniques for assembling polishing pads for chemi-mechanical polishing of silicon wafers | Nicholas F. Pasch, Thomas G. Mallon | 1994-05-10 |