Issued Patents All Time
Showing 51–75 of 77 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7972652 | Electroless plating system | Robert Tas, Shashank Ravindra Kulkarni, Ron Rulkens | 2011-07-05 |
| 7968462 | Noble metal activation layer | Zhi-Wen Sun, Bob Kong, Tony P. Chiang | 2011-06-28 |
| 7897507 | Barrier layer configurations and methods for processing microelectronic topographies having barrier layers | — | 2011-03-01 |
| 7883739 | Method for strengthening adhesion between dielectric layers formed adjacent to metal layers | Weiguo Zhang, Artur Kolics | 2011-02-08 |
| 7884033 | Method of depositing fluids within a microelectric topography processing chamber | — | 2011-02-08 |
| 7779782 | Systems and methods affecting profiles of solutions dispensed across microelectronic topographies during electroless plating processes | — | 2010-08-24 |
| 7780772 | Electroless deposition chemical system limiting strongly adsorbed species | Artur Kolics | 2010-08-24 |
| 7714441 | Barrier layer configurations and methods for processing microelectronic topographies having barrier layers | — | 2010-05-11 |
| 7651723 | Microelectronic fabrication system components and method for processing a wafer using such components | Weiguo Zhang | 2010-01-26 |
| 7648913 | Method of electroless deposition of thin metal and dielectric films with temperature controlled stages of film growth | — | 2010-01-19 |
| 7636234 | Apparatus configurations for affecting movement of fluids within a microelectric topography processing chamber | — | 2009-12-22 |
| 7393414 | Methods and systems for processing a microelectronic topography | Weiguo Zhang | 2008-07-01 |
| 7235483 | Method of electroless deposition of thin metal and dielectric films with temperature controlled stages of film growth | — | 2007-06-26 |
| 7226856 | Nano-electrode-array for integrated circuit interconnects | Sergey Lopatin, Robert W. Fiordalice, Faivel Pintchovski, Wen Zhong Kong, Artur Kolics | 2007-06-05 |
| 6939403 | Spatially-arranged chemical processing station | Chiu H. Ting, Jonathan Weiguo Zhang, Arthur Kolics | 2005-09-06 |
| 6935638 | Universal substrate holder for treating objects in fluids | Jonathan Weiguo Zhang | 2005-08-30 |
| 6913651 | Apparatus and method for electroless deposition of materials on semiconductor substrates | Jonathan Weiguo Zhang, Artur Kolics | 2005-07-05 |
| 6911067 | Solution composition and method for electroless deposition of coatings free of alkali metals | Artur Kolics, Nicolai Petrov, Chiu H. Ting | 2005-06-28 |
| 6908512 | Temperature-controlled substrate holder for processing in fluids | Jonathan Weiguo Zhang, Artur Kolics | 2005-06-21 |
| 6902605 | Activation-free electroless solution for deposition of cobalt and method for deposition of cobalt capping/passivation layer on copper | Artur Kolics, Nicolai Petrov, Chiu H. Ting | 2005-06-07 |
| 6881437 | Methods and system for processing a microelectronic topography | Weiguo Zhang | 2005-04-19 |
| 6860944 | Microelectronic fabrication system components and method for processing a wafer using such components | Welguo Zhang | 2005-03-01 |
| 6846519 | Method and apparatus for electroless deposition with temperature-controlled chuck | Jonathan Welgun Zhang, Artur Kolics | 2005-01-25 |
| 6794288 | Method for electroless deposition of phosphorus-containing metal films onto copper with palladium-free activation | Artur Kolics, Nicolai Petrov, Chiu H. Ting | 2004-09-21 |
| 6402592 | Electrochemical methods for polishing copper films on semiconductor substrates | Mei Zhu, Chiu H. Ting | 2002-06-11 |