Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9023137 | Electroless deposition of platinum on copper | Igor Ivanov, Zhi-Wen Sun, Jinhong Tong | 2015-05-05 |
| 8859427 | Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing | Tony P. Chiang, Chi-I Lang, Zhi-Wen Sun, Jinhong Tong | 2014-10-14 |
| 8728879 | Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing | Tony P. Chiang, Chi-I Lang, Zhi-Wen Sun, Jinhong Tong | 2014-05-20 |
| 8551560 | Methods for improving selectivity of electroless deposition processes | Jinhong Tong, Zhi-Wen Sun, Chi-I Lang, Nitin Kumar, Zachary Fresco | 2013-10-08 |
| 8545998 | Electroless deposition of platinum on copper | Igor Ivanov, Zhi-Wen Sun, Jinhong Tong | 2013-10-01 |
| 8278215 | Noble metal activation layer | Zhi-Wen Sun, Igor Ivanov, Tony P. Chiang | 2012-10-02 |
| 8143164 | Formation of a zinc passivation layer on titanium or titanium alloys used in semiconductor processing | Zhi-Wen Sun, Chi-I Lang, Jinhong Tong, Tony P. Chiang | 2012-03-27 |
| 7968462 | Noble metal activation layer | Zhi-Wen Sun, Igor Ivanov, Tony P. Chiang | 2011-06-28 |
| 6873039 | Methods of making microelectronic packages including electrically and/or thermally conductive element | Masud Beroz, Michael Warner | 2005-03-29 |
| 6797312 | Electroless plating solution and process | Nanhai Li | 2004-09-28 |