Issued Patents All Time
Showing 51–55 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6794285 | Slurry for CMP, and method of manufacturing semiconductor device | Gaku Minamihaba, Hiroyuki Yano | 2004-09-21 |
| 6740590 | AQUEOUS DISPERSION, AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING USED FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICES, AND METHOD FOR FORMATION OF EMBEDDED WRITING | Hiroyuki Yano, Gaku Minamihaba, Katsuya Okumura, Akira Iio, Masayuki Hattori | 2004-05-25 |
| 6576554 | Slurry for CMP, method of forming thereof and method of manufacturing semiconductor device including a CMP process | Gaku Minamihaba, Hiroyuki Yano, Dai Fukushima | 2003-06-10 |
| 6454819 | Composite particles and production process thereof, aqueous dispersion, aqueous dispersion composition for chemical mechanical polishing, and process for manufacture of semiconductor device | Hiroyuki Yano, Gaku Minamihaba, Katsuya Okumura, Masayuki Motonari, Masayuki Hattori +1 more | 2002-09-24 |
| 6375545 | Chemical mechanical method of polishing wafer surfaces | Hiroyuki Yano, Gaku Minamihaba, Nobuo Hayasaka, Katsuya Okumura, Akira Iio +2 more | 2002-04-23 |