Issued Patents All Time
Showing 126–150 of 162 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4993939 | Burner with a cylindrical body | Shuzo Fukuda, Shiro Fukunaka, Michio Nakayama, Koichiro Arima, Shunichi Sugiyama +1 more | 1991-02-19 |
| 4971551 | Burner with a cylindrical body | Shuzo Fukuda, Shiro Fukunaka, Michio Nakayama, Koichiro Arima, Shunichi Sugiyama +1 more | 1990-11-20 |
| 4971553 | Burner with a cylindrical body | Shuzo Fukuda, Shiro Fukunaka, Michio Nakayama, Koichiro Arima, Shunichi Sugiyama +1 more | 1990-11-20 |
| 4971552 | Burner | Shuzo Fukuda, Shiro Fukunaka, Michio Nakayama, Koichiro Arima, Shunichi Sugiyama +1 more | 1990-11-20 |
| 4969815 | Burner | Shuzo Fukuda, Shiro Fukunaka, Michio Nakayama, Koichiro Arima, Shunichi Sugiyama +1 more | 1990-11-13 |
| 4952528 | Photolithographic method for manufacturing semiconductor wiring patterns | Yasukazu Mase, Toshihiko Katsura | 1990-08-28 |
| 4933063 | Sputtering device | Toshihiko Katsura | 1990-06-12 |
| 4931979 | Adding apparatus having a high accuracy | Takashi Kamitake, Shin-ichi Kawamura | 1990-06-05 |
| 4897172 | Sputtering chamber structure for high-frequency bias sputtering process | Toshihiko Katsura | 1990-01-30 |
| 4857141 | Method of forming holes in semiconductor integrated circuit device | Yasukazu Mase | 1989-08-15 |
| 4853760 | Semiconductor device having insulating layer including polyimide film | Masaharu Aoyama, Jiro Ohshima, Takashi Ajima | 1989-08-01 |
| 4760995 | Continuously treating line for steel bands having a heating furnace by directly flaming | Shuzo Fukuda, Shiro Fukunaka, Michio Nakayama, Shuji Kaneto, Masayuki Yamazaki +1 more | 1988-08-02 |
| 4740242 | Method for transferring heat to molten metal, and apparatus therefor | Hideo Nakamura, Kenji Takahashi, Akichika Ozeki, Shunichi Sugiyama, Takanori Anzai | 1988-04-26 |
| 4728627 | Method of making multilayered interconnects using hillock studs formed by sintering | Yasukazu Mase, Masaharu Aoyama | 1988-03-01 |
| 4717682 | Method of manufacturing a semiconductor device with conductive trench sidewalls | Shin-ichi Taka, Jiro Ohshima, Masaharu Aoyama | 1988-01-05 |
| 4689388 | One pack type alicyclic epoxy resin compositions | Kiyomiki Hirai, Koji Takeuchi, Hiroshi Sakamoto | 1987-08-25 |
| 4636832 | Semiconductor device with an improved bonding section | Masaharu Aoyama, Takashi Ajima, Toshio Yonezawa | 1987-01-13 |
| 4634496 | Method for planarizing the surface of an interlayer insulating film in a semiconductor device | Yasukazu Mase, Masaharu Aoyama | 1987-01-06 |
| 4618878 | Semiconductor device having a multilayer wiring structure using a polyimide resin | Masaharu Aoyama, Takashi Ajima, Toshio Yonezawa | 1986-10-21 |
| 4613888 | Semiconductor device of multilayer wiring structure | Yasukazu Mase, Masaharu Aoyama, Takashi Ajima | 1986-09-23 |
| 4610079 | Method of dicing a semiconductor wafer | Masafumi Miyagawa, Hatsuo Nakamura, Toshio Yonezawa | 1986-09-09 |
| 4607832 | Endless belt separator having an unsupported separating surface | — | 1986-08-26 |
| 4544733 | Latent curing agents for epoxy resins | Kiyomiki Hirai, Koji Takeuchi, Nobuo Ito | 1985-10-01 |
| 4542202 | Latent curing agents for epoxy resins | Koji Takeuchi, Nobuo Ito, Kiyomiki Hirai | 1985-09-17 |
| 4530991 | Latent curing agents for epoxy resins | Kiyomiki Hirai, Koji Takeuchi, Nobuo Ito | 1985-07-23 |