Issued Patents All Time
Showing 276–296 of 296 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4912963 | Method and an apparatus for evaluating the gas purifying ability of a gas purifier | Kazuya Mori, Tohru Watanabe | 1990-04-03 |
| 4914056 | Method of manufacturing a semiconductor device having tapered pillars | — | 1990-04-03 |
| 4912052 | Method of testing semiconductor elements | Motosuke Miyoshi | 1990-03-27 |
| 4910398 | Pattern Measurement method | Fumio Komatsu | 1990-03-20 |
| 4902131 | Surface inspection method and apparatus therefor | Yuichiro Yamazaki, Motosuke Miyoshi, Shigeru Ogawa | 1990-02-20 |
| 4891560 | Magnetron plasma apparatus with concentric magnetic means | Atsumu Tezaki | 1990-01-02 |
| 4890029 | Electron beam apparatus including plurality of ion pump blocks | Motosuke Miyoshi | 1989-12-26 |
| 4875088 | Semiconductor device having a backplate electrode | Hidemitsu Egawa, Riichirou Aoki | 1989-10-17 |
| 4823182 | Semiconductor device with a diffusion barrier contact of a refractory metal nitride and either carbon or boron | — | 1989-04-18 |
| 4807021 | Semiconductor device having stacking structure | — | 1989-02-21 |
| 4807159 | Apparatus and method for controlling irradiation of an electron beam at a fixed position in an electron beam tester system | Fumio Komatsu, Motosuke Miyoshi | 1989-02-21 |
| 4800268 | Method and apparatus for scanning a laser beam to examine the surface of semiconductor wafer | Motosuke Miyoshi, Shigeru Ogawa | 1989-01-24 |
| 4787800 | Transfer machine in a surface inspection apparatus | Kazuyoshi Sone, Tomio Nakajima, Kanji Ikegaya | 1988-11-29 |
| 4678114 | Method of wire bonding with applied insulative coating | Hideharu Egawa | 1987-07-07 |
| 4583861 | Surface condition judging apparatus | Hiroshi Yamaji, Shigeru Ogawa | 1986-04-22 |
| 4567364 | Method and apparatus for measuring dimension of secondary electron emission object | Masaaki Kano, Hiroshi Yamaji, Shinji Nakao | 1986-01-28 |
| 4562455 | Semiconductor element | Motosuke Miyoshi | 1985-12-31 |
| 4538344 | Method of forming electrode/wiring layer | Masaaki Ueda | 1985-09-03 |
| 4502210 | Method for manufacturing semiconductor device | Toshinori Shinki, Takashi Sato, Masaaki Ueda | 1985-03-05 |
| 4488674 | Bonding wire, semiconductor device having the same, and bonding method using the same | Hideharu Egawa | 1984-12-18 |
| 4468313 | Sputtering target | Masaaki Ueda | 1984-08-28 |