Issued Patents All Time
Showing 26–50 of 75 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676911 | Method and device for reducing metal burrs when sawing semiconductor packages | HunTeak Lee, DeokKyung Yang | 2023-06-13 |
| 11670618 | System-in-package with double-sided molding | DeokKyung Yang, Yongmin Kim, Jaehyuk Choi, YeoChan Ko | 2023-06-06 |
| 11664327 | Selective EMI shielding using preformed mask | HunTeak Lee, Kyunghwan KIM, ChangOh Kim, KyoungHee Park, JinHee Jung +3 more | 2023-05-30 |
| 11652065 | Semiconductor device and method of embedding circuit pattern in encapsulant for SIP module | JinHee Jung, ChangOh Kim | 2023-05-16 |
| 11652088 | Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same | DeokKyung Yang, HunTeak Lee, Sungsoo Kim | 2023-05-16 |
| 11587882 | Molded laser package with electromagnetic interference shield and method of making | DeokKyung Yang, HunTeak Lee, Wanil Lee, SANGDUK LEE | 2023-02-21 |
| 11434561 | Cooling device and process for cooling double-sided SiP devices during sputtering | OhHan Kim, HunTeak Lee, Sell Jung | 2022-09-06 |
| 11367690 | Semiconductor device and method of forming an integrated SiP module with embedded inductor or package | DeokKyung Yang, WoonJae Beak, YiSu Park, OhHan Kim, HunTeak Lee | 2022-06-21 |
| 11342294 | Semiconductor device and method of forming protrusion e-bar for 3D SiP | DeokKyung Yang, HunTeak Lee, OhHan Kim, DaeHyeok Ha, Wanil Lee | 2022-05-24 |
| 11244908 | Method and device for reducing metal burrs when sawing semiconductor packages | HunTeak Lee, DeokKyung Yang | 2022-02-08 |
| 11189598 | Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same | DeokKyung Yang, HunTeak Lee, Sungsoo Kim | 2021-11-30 |
| 10999035 | Method for mitigation of multiple access interference in mobile communication system and apparatus for the same | Eun Kyung Kim, Tae-Joong Kim, Hyun Seo PARK, An Seok LEE, Yu Ro LEE +1 more | 2021-05-04 |
| 10938534 | Carrier aggregation in wireless communication systems | Young Jo Ko, Tae Gyun Noh, Kyoung Seok Lee, Bang Won SEO, Byung Jang Jeong | 2021-03-02 |
| 10937741 | Molded laser package with electromagnetic interference shield and method of making | DeokKyung Yang, HunTeak Lee, Wanil Lee, SANGDUK LEE | 2021-03-02 |
| 10797024 | System-in-package with double-sided molding | DeokKyung Yang, Yongmin Kim, Jaehyuk Choi, YeoChan Ko | 2020-10-06 |
| 10797039 | Semiconductor device and method of forming a 3D interposer system-in-package module | DeokKyung Yang, OhHan Kim, HunTeak Lee, InSang Yoon, Il Kwon Shim | 2020-10-06 |
| 10790268 | Semiconductor device and method of forming a 3D integrated system-in-package module | DeokKyung Yang, HunTeak Lee | 2020-09-29 |
| 10700011 | Semiconductor device and method of forming an integrated SIP module with embedded inductor or package | DeokKyung Yang, WoonJae Beak, YiSu Park, OhHan Kim, HunTeak Lee | 2020-06-30 |
| 10636756 | Semiconductor device and method of forming protrusion E-bar for 3D SIP | DeokKyung Yang, HunTeak Lee, OhHan Kim, DaeHyeok Ha, Wanil Lee | 2020-04-28 |
| 10636765 | System-in-package with double-sided molding | DeokKyung Yang, Yongmin Kim, Jaehyuk Choi, YeoChan Ko | 2020-04-28 |
| 10636774 | Semiconductor device and method of forming a 3D integrated system-in-package module | DeokKyung Yang, HunTeak Lee | 2020-04-28 |
| 10468384 | Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same | DeokKyung Yang, HunTeak Lee, Sungsoo Kim | 2019-11-05 |
| 10075276 | Carrier aggregation in wireless communication systems | Young Jo Ko, Tae Gyun Noh, Kyoung Seok Lee, Bang Won SEO, Byung Jang Jeong | 2018-09-11 |
| 10021545 | Apparatus and method for transmitting and receiving data in wireless communication system using relay | Jae Young Ahn, Jae Heung Kim, Young Jo Ko, Kyoung Seok Lee | 2018-07-10 |
| 10008589 | Oxide thin film transistor and method of fabricating the same | Hyun-Jae Kim, Jeong Woo Park, Young Jun Tak, Tae Soo Jung, Won Gi KIM +1 more | 2018-06-26 |