Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12372631 | Light detection and ranging (LIDAR) system including a modular assembly | Ashish Bhardwaj, Colin Delaney, Stefan Heinemann, Amir Hosseini, Pruthvi Jujjavarapu +1 more | 2025-07-29 |
| 12352868 | Systems and methods of LIDAR sensor systems having integrated semiconductor devices | James Ferrara, Pruthvi Jujjavarapu, YongXuan Liang, Sen Lin | 2025-07-08 |
| 12332380 | Chip packaging in light detection and ranging (LIDAR) sensor system | Colin Delaney, James Ferrara, Stefan Heinemann, Amir Hosseini, Pruthvi Jujjavarapu +2 more | 2025-06-17 |
| 12199401 | LIDAR sensor system for vehicles including integrated LIDAR chip | James Ferrara, Pruthvi Jujjavarapu, Sen Lin, Xue Liu, Andrew Steil Michaels +1 more | 2025-01-14 |
| 12113331 | System and apparatus for sequential transient liquid phase bonding | Pradeep Srinivasan, Kevin Masuda, Wenjing Liang | 2024-10-08 |
| 11860308 | Chip packaging in light detection and ranging (LIDAR) sensor system | Colin Delaney, James Ferrara, Stefan Heinemann, Amir Hosseini, Pruthvi Jujjavarapu +2 more | 2024-01-02 |
| 11789221 | Techniques for device cooling in an optical sub-assembly | Wenjing Liang, Kevin Masuda, Pradeep Srinivasan | 2023-10-17 |
| 11768279 | Techniques for compact LIDAR system | Pradeep Srinivasan, Bing Shen | 2023-09-26 |
| 11754687 | Light detection and ranging (LIDAR) system including a modular assembly | Ashish Bhardwaj, Colin Delaney, Stefan Heinemann, Amir Hosseini, Pruthvi Jujjavarapu +1 more | 2023-09-12 |
| 11715929 | System and apparatus for sequential transient liquid phase bonding | Pradeep Srinivasan, Kevin Masuda, Wenjing Liang | 2023-08-01 |
| 11378664 | Techniques for compact optical sensing module with hybrid multi-chip integration | Pradeep Srinivasan, Bing Shen | 2022-07-05 |
| 11362485 | Techniques for bonding multiple semiconductor lasers | Pradeep Srinivasan, Kevin Masuda, Wenjing Liang | 2022-06-14 |
| 10969840 | Heat spreaders with interlocked inserts | Aravindha R. Antoniswamy, Syadwad Jain, Wei Hu | 2021-04-06 |
| 10763188 | Integrated heat spreader having electromagnetically-formed features | Aravindha R. Antoniswamy, Thomas J. Fitzgerald, Kumaran Murugesan Chakravarthy, Syadwad Jain, Wei Hu | 2020-09-01 |
| 10651108 | Foam composite | Syadwad Jain, Wei Hu, Michael A. Schroeder, Rajen S. Sidhu, Carl Deppisch +3 more | 2020-05-12 |
| 10214340 | Containers for holding and dispensing stacks of electronic device components | Mingjie Xu, Pan Gu, Bassam M. Ziadeh, Michael Garcia | 2019-02-26 |
| 9713884 | Dimensionally stable polyurethane molded bodies having low density | Andre Kamm, Dong Liang, Lihua Hu | 2017-07-25 |
| 8896110 | Paste thermal interface materials | Wei Hu, Syadwad Jain, Rajen S. Sidhu | 2014-11-25 |
| 8866290 | Molded heat spreaders | Syadwad Jain, Paul R. Start | 2014-10-21 |