| 12027496 |
Film in substrate for releasing z stack-up constraint |
Jianfeng Hu, Yong She, Zhijun Xu |
2024-07-02 |
| 11990395 |
Joint connection of corner non-critical to function (NCTF) ball for BGA solder joint reliability (SJR) enhancement |
Xiaoying Tang, Bin Liu, Yong She, Zhijun Xu |
2024-05-21 |
| 11894344 |
Power enhanced stacked chip scale package solution with integrated die attach film |
Zhijun Xu, Bin Liu, Yong She |
2024-02-06 |
| 11848281 |
Die stack with reduced warpage |
Yong She, Bin Liu, Aiping Tan |
2023-12-19 |
| 11830848 |
Electronic device package |
Bin Liu, Yong She, Hyoung Il Kim |
2023-11-28 |
| 11742284 |
Interconnect structure fabricated using lithographic and deposition processes |
Bin Liu, Yong She, Zhijun Xu |
2023-08-29 |
| 11538746 |
Vertical bond-wire stacked chip-scale package with application-specific integrated circuit die on stack, and methods of making same |
Yong She, Bin Liu, Aiping Tan, Li Deng |
2022-12-27 |
| 11302671 |
Power enhanced stacked chip scale package solution with integrated die attach film |
Zhijun Xu, Bin Liu, Yong She |
2022-04-12 |
| 11148044 |
Input device for intelligent terminal |
Haitao Duan, Peng Li |
2021-10-19 |
| 11101254 |
Flip-chip like integrated passive prepackage for SIP device |
Bin Liu |
2021-08-24 |
| 11081451 |
Die stack with reduced warpage |
Yong She, Bin Liu, Aiping Tan |
2021-08-03 |
| 10991679 |
Stair-stacked dice device in a system in package, and methods of making same |
Bin Liu, Yong She, Aiping Tan, Li Deng |
2021-04-27 |
| 10930622 |
Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same |
Bin Liu, Yong She, Aiping Tan, Li Deng |
2021-02-23 |
| 10910347 |
Method, apparatus and system to interconnect packaged integrated circuit dies |
Yong She, John G. Meyers, Richard Patten |
2021-02-02 |
| 10770434 |
Stair-stacked dice device in a system in package, and methods of making same |
Bin Liu, Yong She, Aiping Tan, Li Deng |
2020-09-08 |
| 10727208 |
Prepackaged stair-stacked memory module in a chip scale system in package, and methods of making same |
Bin Liu, Yong She, Aiping Tan, Li Deng |
2020-07-28 |
| 10396055 |
Method, apparatus and system to interconnect packaged integrated circuit dies |
Yong She, John G. Meyers, Richard Patten |
2019-08-27 |