Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12187603 | Semiconductor package using a polymer substrate | Byung-jun Kim, Dong Hyun Bang, EunNaRa Cho, Adrian Arcedera, Jae Ung Lee | 2025-01-07 |
| 12057434 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone +2 more | 2024-08-06 |
| 12009289 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong +5 more | 2024-06-11 |
| 11572269 | Semiconductor package using a polymer substrate | Byung-jun Kim, Dong Hyun Bang, EunNaRa Cho, Adrian Arcedera, Jae Ung Lee | 2023-02-07 |
| 11488934 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone +2 more | 2022-11-01 |
| 11152296 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong +5 more | 2021-10-19 |
| 10872879 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone +2 more | 2020-12-22 |
| 10822226 | Semiconductor package using a polymer substrate | Byung-jun Kim, Dong Hyun Bang, EunNaRa Cho, Adrian Arcedera, Jae Ung Lee | 2020-11-03 |
| 10163867 | Semiconductor package and manufacturing method thereof | Jin Seong Kim, Edwin J. Adlam, Ludovico E. Bancod, Gi Jung Kim, Robert Lanzone +2 more | 2018-12-25 |
| 10144634 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Byong Jin Kim, Young Seok Kim, Wook Choi, Seung Jae Yoo +2 more | 2018-12-04 |
| 10032705 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, EunNaRa Cho, Dong Hyun Bang, Wook Choi, KooWoong Jeong +5 more | 2018-07-24 |
| 9935083 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Mi Kyeong Choi, Jin Seong Kim | 2018-04-03 |
| 9809446 | Semiconductor package and manufacturing method thereof | Jae Ung Lee, Byong Jin Kim, Young Seok Kim, Wook Choi, Seung Jae Yoo +2 more | 2017-11-07 |
| 9513254 | Microfluidic sensor package structure and method | Hyung-II Jeon, Ji Young Chung, Chan Ha Hwang, Byong Jin Kim, Do Hyun Na +1 more | 2016-12-06 |
| 9056765 | Semiconductor package and manufacturing method thereof | Jong Dae Jung, Dong Hyun Bang, EunNaRa Cho, Byung-jun Kim | 2015-06-16 |