| 10058544 |
(S)-N-(3-(6-isopropoxypyridin-3-yl)-1H-indazol-5-yl)-1-(2-(4-(4-(1-methyl-1H-1,2,4-triazol-3-yl)phenyl)-3,6-dihydropyridin-1(2H)-yl)-2-oxoethyl)-3-(methylthio)pyrrolidine-3-carboxamide compositions for pharmaceutical preparations |
Deepak Bahl, Alfred Lee, William Anthony Marinaro, Jr., Dan Zhang, Tao Feng |
2018-08-28 |
| 7064428 |
Wafer-level package structure |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2006-06-20 |
| 6989326 |
Bump manufacturing method |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +2 more |
2006-01-24 |
| 6967153 |
Bump fabrication process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2005-11-22 |
| 6927964 |
Structure for preventing burnt fuse pad from further electrical connection |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2005-08-09 |
| 6877653 |
Method of modifying tin to lead ratio in tin-lead bump |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2005-04-12 |
| 6875683 |
Method of forming bump |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +2 more |
2005-04-05 |
| 6861346 |
Solder ball fabricating process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +3 more |
2005-03-01 |
| 6846719 |
Process for fabricating wafer bumps |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2005-01-25 |
| 6827252 |
Bump manufacturing method |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +2 more |
2004-12-07 |
| 6828664 |
Packaging substrate with electrostatic discharge protection |
Chih-Pin Hung |
2004-12-07 |
| 6756256 |
Method for preventing burnt fuse pad from further electrical connection |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2004-06-29 |
| 6743707 |
Bump fabrication process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +3 more |
2004-06-01 |
| 6732912 |
Solder ball attaching process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2004-05-11 |
| 6723630 |
Solder ball fabrication process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +3 more |
2004-04-20 |
| 6720244 |
Bump fabrication method |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2004-04-13 |
| 6716739 |
Bump manufacturing method |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +2 more |
2004-04-06 |
| 6713320 |
Bumping process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2004-03-30 |
| 6692581 |
Solder paste for fabricating bump |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Ching-Fu Horng, Shih-Kuang Chen +5 more |
2004-02-17 |
| 6673711 |
Solder ball fabricating process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +3 more |
2004-01-06 |
| 6617237 |
Lead-free bump fabrication process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2003-09-09 |
