Issued Patents All Time
Showing 1–25 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11915939 | Semiconductor fabricating method | Sumiko Fujisaki | 2024-02-27 |
| 11515167 | Plasma etching method and plasma processing apparatus | Sumiko Fujisaki, Hiroyuki Kobayashi, Kazunori Shinoda, Kohei Kawamura, Yutaka Kouzuma +1 more | 2022-11-29 |
| 11515169 | Method of making a semiconductor device including etching of a metal silicate using sequential and cyclic application of reactive gases | — | 2022-11-29 |
| 11380523 | Semiconductor manufacturing apparatus | Sumiko Fujisaki | 2022-07-05 |
| 10910230 | Semiconductor manufacturing apparatus and method for manufacturing semiconductor device | — | 2021-02-02 |
| 10460953 | Semiconductor manufacturing apparatus for manufacturing a semiconductor device having a high-K insulating film, and a method for manufacturing the semiconductor device | — | 2019-10-29 |
| 9001528 | Shielded electronic components and method of manufacturing the same | Chiko Yorita, Yuji Shirai, Yu Hasegawa | 2015-04-07 |
| 8992665 | Metal recovery method and dialysis device | Takehiko Hasebe, Yasuko Yamada | 2015-03-31 |
| 7839484 | Exposure apparatus and exposure method, and method of manufacturing electrical wiring board | Masakazu Kishi | 2010-11-23 |
| 7760328 | Exposure apparatus and exposing method and method of manufacturing a printed wiring board | Hiroshi Oyama | 2010-07-20 |
| 7569967 | Compact disk device and disk drive | Yuji Fujita, Yasuo Amano | 2009-08-04 |
| 7459201 | Compound for forming wiring conductor, fabrication method of circuit board using the same and circuit board | — | 2008-12-02 |
| 7378333 | Semiconductor device and manufacturing method thereof | Toshiya Satoh, Masahiko Ogino, Tadanori Segawa, Hiroyuki Tenmei, Atsushi Kazama +2 more | 2008-05-27 |
| 7084498 | Semiconductor device having projected electrodes and structure for mounting the same | Shigeharu Tsunoda, Hiroyuki Tenmei, Hiroshi Hozoji, Naoya Kanda | 2006-08-01 |
| 7057283 | Semiconductor device and method for producing the same | Kosuke Inoue, Hiroyuki Tenmei, Noriyuki Oroku, Hiroshi Hozoji, Shigeharu Tsunoda +6 more | 2006-06-06 |
| 7002250 | Semiconductor module | Hiroshi Hozoji, Naoya Kanda, Shigeharu Tunoda, Hiroyuki Tenmei | 2006-02-21 |
| 6998713 | Wiring board and method for producing same | Yasumori Narizuka, Mitsuko Itou, Hiroyuki Tenmei | 2006-02-14 |
| 6949416 | Method of manufacturing a semiconductor integrated circuit device | Toshio Miyamoto, Ichiro Anjo, Asao Nishimura | 2005-09-27 |
| 6946327 | Semiconductor device and manufacturing method of that | Toshio Miyamoto, Ichiro Anjo, Asao Nishimura, Mitsuaki Katagiri, Yuji Shirai | 2005-09-20 |
| 6946723 | Semiconductor device and manufacturing method thereof | Toshiya Satoh, Masahiko Ogino, Tadanori Segawa, Hiroyuki Tenmei, Atsushi Kazama +2 more | 2005-09-20 |
| 6930388 | Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure | Hiroyuki Tenmei, Kosuke Inoue, Noriyuki Oroku, Hiroshi Hozoji, Shigeharu Tsunoda +6 more | 2005-08-16 |
| 6861742 | Wafer level chip size package having rerouting layers | Toshio Miyamoto, Ichiro Anjo, Asao Nishimura, Mitsuaki Katagiri, Yuji Shirai | 2005-03-01 |
| 6822317 | Semiconductor apparatus including insulating layer having a protrusive portion | Kosuke Inoue, Hiroyuki Tenmei, Noriyuki Oroku, Hiroshi Hozoji, Shigeharu Tsunoda +6 more | 2004-11-23 |
| 6791178 | Multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices | Takao Terabayashi, Hiroyuki Tenmei, Hiroshi Hozoji, Naoya Kanda | 2004-09-14 |
| 6780748 | Method of fabricating a wafer level chip size package utilizing a maskless exposure | Hiroyuki Tenmei, Hiroshi Hozoji, Naoya Kanda | 2004-08-24 |