Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7354790 | Method and apparatus for avoiding dicing chip-outs in integrated circuit die | Parthasarathy Rajagopalan, Zafer Kutlu, Emery Sugasawara, Charles E. VONDERACH, Dilip Vijay +2 more | 2008-04-08 |
| 7145232 | Construction to improve thermal performance and reduce die backside warpage | Rajagopalan Parthasarathy, Kishore Desai | 2006-12-05 |
| 6825066 | Stiffener design | Anand Govind, Kumar Nagarajan, Farshad Ghahghahi, Aritharan Thurairajaratnam | 2004-11-30 |
| 6759921 | Characteristic impedance equalizer and an integrated circuit package employing the same | Anand Govind | 2004-07-06 |