Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142575 | Staircase etch control in forming three-dimensional memory device | Zhenyu Lu, Lidong Song, Feng Pan, Xiaowang Dai, Dan Liu +2 more | 2024-11-12 |
| 12137567 | Interconnect structure of three-dimensional memory device | Zhenyu Lu, Lidong Song, Feng Pan, Steve Weiyi Yang, Wenguang Shi | 2024-11-05 |
| 11991880 | Three-dimensional memory devices and fabricating methods thereof | Zhenyu Lu, Yu Ru Huang, Qian Tao, Yushi Hu, Jun Chen +3 more | 2024-05-21 |
| 10998079 | Structure and method for testing three-dimensional memory device | Jong-jun Kim, Feng Pan, Jong Seuk Lee, Zhenyu Lu, Lidong Song +3 more | 2021-05-04 |
| 10930663 | Interconnect structure of three-dimensional memory device | Zhenyu Lu, Lidong Song, Feng Pan, Steve Weiyi Yang, Wenguang Shi | 2021-02-23 |
| 10804287 | Three-dimensional memory devices and fabricating methods thereof | Zhenyu Lu, Yu Ru Huang, Qian Tao, Yushi Hu, Jun Chen +3 more | 2020-10-13 |
| 10679721 | Structure and method for testing three-dimensional memory device | Jong-jun Kim, Feng Pan, Jong Seuk Lee, Zhenyu Lu, Lidong Song +3 more | 2020-06-09 |
| 10593624 | Three dimensional storage cell array with highly dense and scalable word line design approach | Deepak Thimmegowda, Aaron Yip, Mark A. Helm | 2020-03-17 |
| 10522474 | Staircase etch control in forming three-dimensional memory device | Zhenyu Lu, Lidong Song, Feng Pan, Xiaowang Dai, Dan Liu +2 more | 2019-12-31 |
| 10043751 | Three dimensional storage cell array with highly dense and scalable word line design approach | Deepak Thimmegowda, Aaron Yip, Mark A. Helm | 2018-08-07 |