Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051660 | Wire bond pad design for compact stacked-die package | Fuqiang Xiao, Cong Zhang, Kuo-Chien Wang, Chin-Tien Chiu | 2024-07-30 |
| 11456279 | Integrated electronic element module, semiconductor package, and method for fabricating the same | Cong Zhang, Chin-Tien Chiu, Qi Deng | 2022-09-27 |
| 11425817 | Side contact pads for high-speed memory card | Shineng Ma, Chih-Chin Liao, Chin-Tien Chiu, JinXiang Huang | 2022-08-23 |
| 11302673 | Semiconductor device including vertically stacked semiconductor dies | Cong Zhang, Chin-Tien Chiu | 2022-04-12 |
| 11276669 | High capacity semiconductor device including bifurcated memory module | Shineng Ma, Cong Zhang, Chin-Tien Chiu | 2022-03-15 |
| 11257785 | Multi-module integrated interposer and semiconductor device formed therefrom | Cong Zhang, Chin-Tien Chiu, Yazhou Zhang | 2022-02-22 |
| 11189582 | Wire bond pad design for compact stacked-die package | Fuqiang Xiao, Cong Zhang, Kuo-Chien Wang, Chin-Tien Chiu | 2021-11-30 |
| 11139277 | Semiconductor device including contact fingers on opposed surfaces | Chien-Te Chen, Cong Zhang, Hsiang Ju Huang, Yu Ying Tan, Han-Shiao Chen | 2021-10-05 |