Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12164032 | Method for creating occupancy grid map and processing apparatus | Naiyan Wang | 2024-12-10 |
| 11630210 | Method for creating occupancy grid map and processing apparatus | Naiyan Wang | 2023-04-18 |
| RE49202 | Copper electrodeposition in microelectronics | Vincent Paneccasio, Jr., Paul Figura, Richard Hurtubise | 2022-09-06 |
| 11315486 | Image processing circuit and image processing method with overdriving illumination element | Shang-Yu Su, Feng-Ting Pai | 2022-04-26 |
| 10541140 | Process for filling vias in the microelectronics | Thomas B. Richardson, Joseph A. Abys, Wenbo Shao, Chen Wang, Vincent Paneccasio, Jr. +2 more | 2020-01-21 |
| 10339895 | Brightness compensation circuitry, and display device including the same | Ya-Hsiang Tai, Chun-Yi Chang | 2019-07-02 |
| 10221496 | Copper filling of through silicon vias | Thomas B. Richardson, Wenbo Shao, Cai Wang, Vincent Paneccasio, Jr., Joseph A. Abys +3 more | 2019-03-05 |
| 9613858 | Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers | Vincent Paneccasio, Jr., Richard Hurtubise, Qingyun Chen | 2017-04-04 |
| 9493884 | Copper electrodeposition in microelectronics | Vincent Paneccasio, Jr., Richard Hurtubise, Paul Figura | 2016-11-15 |
| 9222188 | Defect reduction in electrodeposited copper for semiconductor applications | John Commander, Richard Hurtubise, Vincent Paneccasio, Jr., Kshama Jirage | 2015-12-29 |
| 8771495 | Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers | Vincent Paneccasio, Jr., Richard Hurtubise, Qingyun Chen | 2014-07-08 |
| 8608933 | Copper electrodeposition in microelectronics | Vincent Paneccasio, Jr., Richard Hurtubise, Paul Figura | 2013-12-17 |
| 8388824 | Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers | Vincent Paneccasio, Jr., Richard Hurtubise, Qingyun Chen | 2013-03-05 |
| 8002962 | Copper electrodeposition in microelectronics | Vincent Paneccasio, Jr., Paul Figura, Richard Hurtubise | 2011-08-23 |
| 7998859 | Surface preparation process for damascene copper deposition | Qingyun Chen, Vincent Paneccasio, Jr., Richard Hurtubise, Joseph A. Abys | 2011-08-16 |
| 7968455 | Copper deposition for filling features in manufacture of microelectronic devices | Richard Hurtubise, Vincent Paneccasio, Jr., Qingyun Chen | 2011-06-28 |
| 7815786 | Copper electrodeposition in microelectronics | Vincent Paneccasio, Jr., Paul Figura, Richard Hurtubise | 2010-10-19 |
| 7670950 | Copper metallization of through silicon via | Thomas B. Richardson, Yun Zhang, Chen Wang, Vincent Paneccasio, Jr., Cai Wang +2 more | 2010-03-02 |
| 7316772 | Defect reduction in electrodeposited copper for semiconductor applications | John Commander, Richard Hurtubise, Vincent Paneccasio, Jr., Kshama Jirage | 2008-01-08 |
| 7303992 | Copper electrodeposition in microelectronics | Vincent Paneccasio, Jr., Paul Figura, Richard Hurtubise | 2007-12-04 |
| 7241371 | Additive-assisted, cerium-based, corrosion-resistant e-coating | James O. Stoffer, Thomas J. O'Keefe, Eric L. Morris, Scott Hayes, Pu Yu | 2007-07-10 |
| 7048807 | Cerium-based spontaneous coating process for corrosion protection of aluminum alloys | James O. Stoffer, Thomas J. O'Keefe, Matthew J. O'Keefe, Eric L. Morris, Scott Hayes +3 more | 2006-05-23 |
| 6818116 | Additive-assisted cerium-based electrolytic coating process for corrosion protection of aluminum alloys | James O. Stoffer, Thomas J. O'Keefe, Eric L. Morris, Scott Hayes, Paul Yu +1 more | 2004-11-16 |
| 5932083 | Electrodeposition of cerium-based coatings for corrosion protection of aluminum alloys | James O. Stoffer, Thomas J. O'Keefe, Eric L. Morris, Pu Yu, Srinivas Pravin Sitaram | 1999-08-03 |