Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9257309 | Multi-chip package and method of manufacturing the same | Hee Jin Lee | 2016-02-09 |
| 9245827 | 3D semiconductor device | Uk-Song Kang, Dong-Hyeon Jang, Seong-Jin Jang, Hoon Lee, Jin Ho Kim +2 more | 2016-01-26 |
| 9177886 | Semiconductor package including chip support and method of fabricating the same | Ji-Han Ko, Tae-Sung Park | 2015-11-03 |
| 8743582 | 3D semiconductor device | Uk-Song Kang, Dong-Hyeon Jang, Seong-Jin Jang, Hoon Lee, Jin Ho Kim +2 more | 2014-06-03 |
| 8710677 | Multi-chip package with a supporting member and method of manufacturing the same | Hee Jin Lee | 2014-04-29 |
| 8513802 | Multi-chip package having semiconductor chips of different thicknesses from each other and related device | Keum-Hee Ma, Min-Seung Yoon, Ju-Il Choi, Sang-Sick Park, Son-Kwan Hwang | 2013-08-20 |
| 7589405 | Memory cards and method of fabricating the memory cards | Min Young Son | 2009-09-15 |
| 6812578 | Semiconductor device bonding pad resistant to stress and method of fabricating the same | Shin-Hye Kim, Tae-Gyeong Chung, Nam-Seog Kim, Jin Hyuk Lee | 2004-11-02 |
| 6591789 | Device to generate heat by spraying liquid at high speed and high pressure | — | 2003-07-15 |