Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11920868 | Micro-channel pulsating heat pipe | John R. Thome | 2024-03-05 |
| 11616185 | Energy harvesting device for electronic devices | Jorge Luis Rosales, Mario Francisco Velez, Peng Wang | 2023-03-28 |
| 11209215 | Enhanced cooling of an electronic device using micropumps in thermosiphons | Jorge Luis Rosales | 2021-12-28 |
| 11181323 | Heat-dissipating device with interfacial enhancements | Sean ANDREWS, Jorge Luis Rosales | 2021-11-23 |
| 10606327 | Heat reduction using selective insulation and thermal spreading | Jorge Luis Rosales, Peng Wang | 2020-03-31 |
| 10405463 | Multi-rotor aerial drone with vapor chamber | Jorge Luis Rosales, Jose Gilberto Corleto Mena | 2019-09-03 |
| 10381562 | Method and apparatus for cooling of an electronic device | Jorge Luis Rosales, Sean ANDREWS | 2019-08-13 |
| 10353445 | Multi-phase heat dissipating device for an electronic device | Jorge Luis Rosales, Stephen Molloy, Jon James Anderson | 2019-07-16 |
| 9999157 | Multi-phase heat dissipating device embedded in an electronic device | Jorge Luis Rosales, Jon James Anderson, Stephen Molloy | 2018-06-12 |
| 9918407 | Multi-layer heat dissipating device comprising heat storage capabilities, for an electronic device | Jorge Luis Rosales | 2018-03-13 |
| 9329646 | Multi-layer heat dissipating apparatus for an electronic device | Youmin Yu, Dexter Tamio Chun, Stephen Molloy | 2016-05-03 |
| 9165854 | Heat dissipation features, electronic devices incorporating heat dissipation features, and methods of making heat dissipation features | Dexter Tamio Chun, James H. Thompson, Stephen Molloy | 2015-10-20 |
| 9148979 | Heat dissipating apparatus for folding electronic devices | Dexter Tamio Chun | 2015-09-29 |
| 9136202 | Enhanced package thermal management using external and internal capacitive thermal material | Durodami LISK, Ratibor Radojcic | 2015-09-15 |
| 9041212 | Thermal design and electrical routing for multiple stacked packages using through via insert (TVI) | Dong Wook Kim, Kyu-Pyung Hwang, Changhan Hobie Yun, Young Kyu Song | 2015-05-26 |
| 8595525 | On-chip thermal management techniques using inter-processor time dependent power density data for indentification of thermal aggressors | Jon James Anderson, Sorin Adrian Dobre, Maria Lupetini, Joseph Victor Zanotelli | 2013-11-26 |
| 8393350 | Methods and apparatus for introducing additives into a fluid flow | David E. Bien | 2013-03-12 |
| 7892882 | Methods and apparatus for a semiconductor device package with improved thermal performance | George R. Leal, Tien-Yu Lee, Marc Alan Mangrum, Robert J. Wenzel | 2011-02-22 |
| 7821787 | System and method for cooling using impinging jet control | — | 2010-10-26 |
| 7778030 | Method for cooling using impinging jet control | — | 2010-08-17 |
| 7405102 | Methods and apparatus for thermal management in a multi-layer embedded chip structure | Tien-Yu Lee, Craig Amrine, Lizabeth Keser, George R. Leal, Robert J. Wenzel | 2008-07-29 |
| 6906900 | Structure and method of thermally protecting power devices for airbag deployment | Paul T. Bennett, Tien-Yu Lee, David Domenic Putti, William E. Edwards | 2005-06-14 |
| 6418016 | System and method for cooling using an oscillatory impinging jet | Tien-Yu Lee | 2002-07-09 |