Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10608125 | Exposed die sensor package | — | 2020-03-31 |
| 10204876 | Pad defined contact for wafer level package | Ricky Agrawal, Abhishek Choudhury | 2019-02-12 |
| 9583425 | Solder fatigue arrest for wafer level package | Yong Li Xu, Xiansong Chen, Kaysar Rahim, Viren Khandekar, Yi-Sheng Anthony Sun +1 more | 2017-02-28 |
| 9425064 | Low-cost low-profile solder bump process for enabling ultra-thin wafer-level packaging (WLP) packages | Karthik Thambidurai, Viren Khandekar | 2016-08-23 |
| 9371982 | Glass based multichip package | — | 2016-06-21 |
| 9356003 | Highly integrated flex sensor package | — | 2016-05-31 |
| 9040408 | Techniques for wafer-level processing of QFN packages | Joseph W. Serpiello, Md. Kaysar Rahim, Yong Li Xu, Karthik Thambidurai, Viren Khandekar | 2015-05-26 |
| 8259464 | Wafer level package (WLP) device having bump assemblies including a barrier metal | Arkadii V. Samoilov | 2012-09-04 |
| 8163220 | Method of packaging integrated circuits | Michael J. Hundt | 2012-04-24 |
| 8084871 | Redistribution layer enhancement to improve reliability of wafer level packaging | S. Kaysar Rahim, Arkadii V. Samoilov, Viren Khandekar, Yong Li Xu | 2011-12-27 |
| 7402454 | Molded integrated circuit package with exposed active area | Michael J. Hundt | 2008-07-22 |
| 7315079 | Thermally-enhanced ball grid array package structure and method | Michael J. Hundt | 2008-01-01 |
| 7304362 | Molded integrated circuit package with exposed active area | Michael J. Hundt | 2007-12-04 |
| 7294530 | Method for encapsulating multiple integrated circuits | — | 2007-11-13 |
| 7244967 | Apparatus and method for attaching an integrating circuit sensor to a substrate | Michael J. Hundt | 2007-07-17 |
| 7180175 | Thermally-enhanced ball grid array package structure and method | Michael J. Hundt | 2007-02-20 |
| 6998721 | Stacking and encapsulation of multiple interconnected integrated circuits | — | 2006-02-14 |
| 6900535 | BGA/LGA with built in heat slug/spreader | — | 2005-05-31 |
| 6817854 | Mold with compensating base | Michael J. Hundt | 2004-11-16 |
| 6815262 | Apparatus and method for attaching an integrated circuit sensor to a substrate | Michael J. Hundt | 2004-11-09 |
| 6686227 | Method and system for exposed die molding for integrated circuit packaging | Michael J. Hundt | 2004-02-03 |
| 6586821 | Lead-frame forming for improved thermal performance | Michael J. Hundt | 2003-07-01 |