| 11935228 |
Method to acquire a 3D image of a sample structure |
Ramani Pichumani, Christoph Graf Vom Hagen, Jens Timo Neumann, Johannes Ruoff |
2024-03-19 |
| 11817231 |
Detection system for X-ray inspection of an object |
Johannes Ruoff, Juan Atkinson Mora, Thomas A. Case, Heiko Feldmann, Christoph Graf Vom Hagen +1 more |
2023-11-14 |
| 11121108 |
Flip chip package utilizing trace bump trace interconnection |
Tzu-Hung Lin |
2021-09-14 |
| 10707183 |
Flip chip package utilizing trace bump trace interconnection |
Tzu-Hung Lin |
2020-07-07 |
| 10354970 |
Flip chip package utilizing trace bump trace interconnection |
Tzu-Hung Lin |
2019-07-16 |
| 9659893 |
Semiconductor package |
Tzu-Hung Lin, Ching-Liou Huang |
2017-05-23 |
| 9640505 |
Semiconductor package with trace covered by solder resist |
Tzu-Hung Lin, Ching-Liou Huang |
2017-05-02 |
| 9437534 |
Enhanced flip chip structure using copper column interconnect |
Tzu-Hung Lin, Che-Ya Chou |
2016-09-06 |
| 9437512 |
Integrated circuit package structure |
Tzu-Hung Lin |
2016-09-06 |
| 9142526 |
Semiconductor package with solder resist capped trace to prevent underfill delamination |
Tzu-Hung Lin, Ching-Liou Huang |
2015-09-22 |
| 9064757 |
Enhanced flip chip structure using copper column interconnect |
Tzu-Hung Lin, Che-Ya Chou |
2015-06-23 |
| 9040359 |
Molded interposer package and method for fabricating the same |
Andrew C. Chang, Tzu-Hung Lin |
2015-05-26 |
| 8957518 |
Molded interposer package and method for fabricating the same |
Andrew C. Chang, Tzu-Hung Lin |
2015-02-17 |
| 8859340 |
Molded interposer package and method for fabricating the same |
Andrew C. Chang, Tzu-Hung Lin |
2014-10-14 |
| 8633588 |
Semiconductor package |
Tzu-Hung Lin, Ching-Liou Huang |
2014-01-21 |
| 8502377 |
Package substrate for bump on trace interconnection |
Tzu-Hung Lin, Ching-Liou Huang |
2013-08-06 |
| 8390119 |
Flip chip package utilizing trace bump trace interconnection |
Tzu-Hung Lin |
2013-03-05 |