Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7989356 | Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability | Xusheng Bao, Yaojian Lin | 2011-08-02 |
| 7863726 | Integrated circuit package system with package substrate having corner contacts and method of manufacture thereof | Seng Guan Chow | 2011-01-04 |
| 7646105 | Integrated circuit package system with package substrate having corner contacts | Seng Guan Chow | 2010-01-12 |
| 7190071 | Semiconductor package and method for fabricating the same | Won Sun Shin, Seon Goo Lee, Do Sung Chun, Vincent DiCaprio | 2007-03-13 |
| 6717248 | Semiconductor package and method for fabricating the same | Won Sun Shin, Seon Goo Lee, Do Sung Chun, Vincent DiCaprio | 2004-04-06 |
| 6515356 | Semiconductor package and method for fabricating the same | Won Sun Shin, Seon Goo Lee, Do Sung Chun, Vincent DiCaprio | 2003-02-04 |
| 6469258 | Circuit board for semiconductor package | Choon Heung Lee, Won Dai Shin, Chang Hoon Ko, Won Sun Shin, Seon Goo Lee +2 more | 2002-10-22 |