| 8508034 |
Electronic devices |
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2013-08-13 |
| 8115296 |
Electronic device package |
Todd O. Bolken, Cary J. Baerlocher, Chad A. Cobbley |
2012-02-14 |
| 7528007 |
Methods for assembling semiconductor devices and interposers |
Setho Sing Fee, Lim Thiam Chye, Leng Nam Yin, Keith Tan, Patrick Guay +3 more |
2009-05-05 |
| 7274095 |
Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers |
Setho Sing Fee, Lim Thiam Chye, Leng Nam Yin, Keith Tan, Patrick Guay +3 more |
2007-09-25 |
| 7026548 |
Moisture-resistant electronic device package and methods of assembly |
Todd O. Bolken, Cary J. Baerlocher, Chad A. Cobbley |
2006-04-11 |
| 6953891 |
Moisture-resistant electronic device package and methods of assembly |
Todd O. Bolken, Cary J. Baerlocher, Chad A. Cobbley |
2005-10-11 |
| 6746894 |
Ball grid array interposer, packages and methods |
Setho Sing Fee, Lim Thiam Chye, Leng Nam Yin, Keith Tan, Patrick Guay +3 more |
2004-06-08 |
| 6399464 |
Packaging die preparation |
Tom A. Muntifering, Michael Ball |
2002-06-04 |
| 6162703 |
Packaging die preparation |
Tom A. Muntifering, Michael Ball |
2000-12-19 |
| 5248075 |
IC pin forming machine with integrated IC testing capability |
Jerry A. Young, Steven L. Mitchell |
1993-09-28 |
