SH

Stefan Hau-Riege

IN Intel: 8 patents #4,870 of 30,777Top 20%
AM AMD: 3 patents #3,141 of 9,279Top 35%
University of California: 3 patents #2,984 of 18,278Top 20%
LS Lawrence Livermore National Security: 2 patents #548 of 1,665Top 35%
Overall (All Time): #300,482 of 4,157,543Top 8%
16
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
7867441 Low to moderate temperature nanolaminate heater J. Del Eckels, Peter J. Nunes, Randall L. Simpson, Chris Walton, J. Chance Carter +1 more 2011-01-11
7672430 Area X-ray or UV camera system for high-intensity beams Henry N. Chapman, Sasa Bajt, Eberhard A. Spiller, Stefano Marchesini 2010-03-02
7300871 Method of doping a conductive layer near a via R. Scott List 2007-11-27
7236565 Tamper to delay motion and decrease ionization of a sample during short pulse x-ray imaging Richard London, Abraham Szoke, Henry N. Chapman 2007-06-26
7212282 Method for characterizing mask defects using image reconstruction from X-ray diffraction patterns — 2007-05-01
7153774 Method of making a semiconductor device that has copper damascene interconnects with enhanced electromigration reliability Christine Hau-Riege, Wen-Yue Zheng 2006-12-26
7087516 Electromigration-reliability improvement of dual damascene interconnects — 2006-08-08
6925216 Direct-patterned optical waveguides on amorphous silicon films Steve Vernon, Tiziana C. Bond, Steven W. Bond, Michael D. Pocha 2005-08-02
6870262 Wafer-bonding using solder and method of making the same Christine Hau-Riege 2005-03-22
6833321 Method of making a semiconductor device that has copper damascene interconnects with enhanced electromigration reliability R. Scott List 2004-12-21
6822473 Determination of permeability of layer material within interconnect Christine Hau-Riege, Amit P. Marathe 2004-11-23
6768323 System and method for determining location of extrusion in interconnect Christine Hau-Riege 2004-07-27
6762597 Structure, system, and method for assessing electromigration permeability of layer material within interconnect Christine Hau-Riege, Amit P. Marathe 2004-07-13
6717268 Electromigration-reliability improvement of dual damascene interconnects — 2004-04-06
6667225 Wafer-bonding using solder and method of making the same Christine Hau-Riege 2003-12-23
6579795 Method of making a semiconductor device that has copper damascene interconnects with enhanced electromigration reliability — 2003-06-17