Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7897508 | Method to eliminate Cu dislocation for reliability and yield | Gang Mao, Jian Cui | 2011-03-01 |
| 7153774 | Method of making a semiconductor device that has copper damascene interconnects with enhanced electromigration reliability | Stefan Hau-Riege, Christine Hau-Riege | 2006-12-26 |