Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652084 | Flat lead package formation method | Thorsten Meyer, Gerald Ofner, Stefan Miethaner, Alexander Heinrich, Horst Theuss +1 more | 2023-05-16 |
| 11410906 | Semiconductor package and method for fabricating a semiconductor package | Juergen Hoegerl, Bernd Betz, Daniel Obermeier | 2022-08-09 |
| 11302668 | Multi-purpose non-linear semiconductor package assembly line | Thorsten Meyer, Gerald Ofner, Stefan Miethaner, Alexander Heinrich, Horst Theuss +1 more | 2022-04-12 |
| 10566309 | Multi-purpose non-linear semiconductor package assembly line | Thorsten Meyer, Gerald Ofner, Peter Scherl, Stefan Miethaner, Alexander Heinrich +1 more | 2020-02-18 |
| 9601475 | Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips | Markus Brunnbauer, Thorsten Meyer, Ralf Plieninger, Jens Pohl, Klaus Pressel +1 more | 2017-03-21 |
| 9293423 | Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chips | Markus Brunnbauer, Thorsten Meyer, Ralf Plieninger, Jens Pohl, Klaus Pressel +1 more | 2016-03-22 |
| 8759230 | Treatment of a substrate with a liquid medium | Michael Melzl, Josef Schwaiger, Thilo Stache | 2014-06-24 |
| 8309454 | Structure for electrostatic discharge in embedded wafer level packages | Markus Brunnbauer, Thorsten Meyer, Ralf Plieninger, Jens Pohl, Klaus Pressel +1 more | 2012-11-13 |
| 8173534 | Method for producing a semiconductor wafer with rear side identification | Rainer Holmer | 2012-05-08 |
| 7911036 | Semiconductor wafer with rear side identification and method | Rainer Holmer | 2011-03-22 |
| 7906860 | Semiconductor device | Thorsten Meyer, Markus Brunnbauer, Marcus Kastner | 2011-03-15 |
| 7902062 | Electrodepositing a metal in integrated circuit applications | Klaus Kerkel, Christine Lindner | 2011-03-08 |
| 7759792 | Integrated circuit including parylene material layer | Thorsten Meyer, Markus Brunnbauer | 2010-07-20 |
| 7687895 | Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips | Markus Brunnbauer, Jens Pohl, Klaus Pressel, Thorsten Meyer, Recai Sezi +1 more | 2010-03-30 |
| 7566378 | Arrangement of electronic semiconductor components on a carrier system for treating said semiconductor components with a liquid medium | Michael Melzl, Josef Schwaiger, Thilo Stache | 2009-07-28 |
| 6459296 | Method, system and method of using a component for setting the electrical characteristics of microelectronic circuit configurations | Oliver Gehring, Olaf Heitzsch | 2002-10-01 |
| 6447372 | Polishing agent for semiconductor substrates | Olaf Heitzsch | 2002-09-10 |
| 6337255 | Method for forming a trench structure in a silicon substrate | Olaf Heitzsch, Michael J. Schmidt | 2002-01-08 |
| 6086269 | Method and apparatus for applying a substance to a surface | Elke Hietschold | 2000-07-11 |
| 6014218 | Device and method for end-point monitoring used in the polishing of components, in particular semiconductor components | Olaf Heitzsch | 2000-01-11 |