Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11296000 | Formation of conductive connection tracks in package mold body using electroless plating | Cher Hau Danny Koh, Norliza Morban, Yong Chern Poh, Khay Chwan Saw | 2022-04-05 |
| 10937744 | Semiconductor packages including roughening features | Wern Ken Daryl Wee, Sock Chien Tey | 2021-03-02 |
| 10741466 | Formation of conductive connection tracks in package mold body using electroless plating | Cher Hau Danny Koh, Norliza Morban, Yong Chern Poh, Khay Chwan Saw | 2020-08-11 |