Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12347813 | Semiconductor package and related methods | Chee Hiong CHEW, Erik Nino Tolentino, Vemmond Jeng Hung NG | 2025-07-01 |
| 12170239 | Direct bonded copper substrates fabricated using silver sintering | Erik Nino Tolentino, Francis J. Carney | 2024-12-17 |
| 12160060 | Bonding module pins to an electronic substrate | Erik Nino Tolentino, Dennis Cadiz YBORDE, Pui Leng LOW | 2024-12-03 |
| 11942369 | Thin semiconductor package for notched semiconductor die | Sw Wang, CH CHEW, How Kiat Liew, Fui Fui Tan | 2024-03-26 |
| 11830856 | Semiconductor package and related methods | Chee Hiong CHEW, Erik Nino Tolentino, Vemmond Jeng Hung NG | 2023-11-28 |
| 11776870 | Direct bonded copper substrates fabricated using silver sintering | Erik Nino Tolentino, Francis J. Carney | 2023-10-03 |
| 11721654 | Ultra-thin multichip power devices | Nurul Nadiah Manap, Soon Wei WANG | 2023-08-08 |
| 11626677 | Bonding module pins to an electronic substrate | Erik Nino Tolentino, Dennis Cadiz YBORDE, Pui Leng LOW | 2023-04-11 |
| 10930604 | Ultra-thin multichip power devices | Nurul Nadiah Manap, Soon Wei WANG | 2021-02-23 |
| 10763173 | Thin semiconductor package and related methods | Sw Wang, CH CHEW, How Kiat Liew, Fui Fui Tan | 2020-09-01 |
| 10319639 | Thin semiconductor package and related methods | Sw Wang, CH CHEW, How Kiat Liew, Fui Fui Tan | 2019-06-11 |
| 10106419 | Method of making graphene nanocomposites by multiphase fluid dynamic dispersion | — | 2018-10-23 |
| 9997485 | Bonding structure and method | Yun Sung Won | 2018-06-12 |
| 9780059 | Bonding structure and method | Yun Sung Won | 2017-10-03 |
| 8519521 | Electronic device including a packaging substrate having a trench | Chee Hiong CHEW, Jatinder Kumar | 2013-08-27 |
| 8451621 | Semiconductor component and method of manufacture | Soon Wei WANG | 2013-05-28 |
| 8449339 | Connector assembly and method of manufacture | Soon Wei WANG | 2013-05-28 |
| 8268676 | Process of forming an electronic device including removing a conductive member to form a trench and electrically isolate leads | Chee Hiong CHEW, Jatinder Kumar | 2012-09-18 |
| 7939380 | Method of manufacturing a semiconductor component with a low cost leadframe using a non-metallic base structure | Soon Wei WANG, Jatinder Kumar | 2011-05-10 |
| 7402895 | Semiconductor package structure and method of manufacture | Jatinder Kumar | 2008-07-22 |