Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11942369 | Thin semiconductor package for notched semiconductor die | Shutesh Krishnan, Sw Wang, How Kiat Liew, Fui Fui Tan | 2024-03-26 |
| 11791297 | Molded semiconductor package and related methods | Sw Wang, Eiji KUROSE, How Kiat Liew | 2023-10-17 |
| 11244918 | Molded semiconductor package and related methods | Sw Wang, Eiji KUROSE, How Kiat Liew | 2022-02-08 |
| 10763173 | Thin semiconductor package and related methods | Shutesh Krishnan, Sw Wang, How Kiat Liew, Fui Fui Tan | 2020-09-01 |
| 10319639 | Thin semiconductor package and related methods | Shutesh Krishnan, Sw Wang, How Kiat Liew, Fui Fui Tan | 2019-06-11 |