Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11761565 | Clamp ring type metal sealgas pipe joint | Jiaqi Sun, Yifeng JIANG | 2023-09-19 |
| 9842775 | Semiconductor device and method of forming a thin wafer without a carrier | Pandi C. Marimuthu, Nathapong Suthiwongsunthorn | 2017-12-12 |
| 9640504 | Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core | Reza A. Pagaila, Byung Tai Do | 2017-05-02 |
| 9443762 | Semiconductor device and method of forming a thin wafer without a carrier | Pandi C. Marimuthu, Nathapong Suthiwongsunthorn | 2016-09-13 |
| 9263361 | Semiconductor device having a vertical interconnect structure using stud bumps | Reza A. Pagaila, Byung Tai Do, Rajendra D. Pendse | 2016-02-16 |
| 9236352 | Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the die | Reza A. Pagaila, Byung Tai Do, Nathapong Suthiwongsunthorn, Dioscoro A. Merilo | 2016-01-12 |
| 8742579 | Semiconductor device and method of providing Z-interconnect conductive pillars with inner polymer core | Reza A. Pagaila, Byung Tai Do | 2014-06-03 |
| 8531015 | Semiconductor device and method of forming a thin wafer without a carrier | Pandi C. Marimuthu, Nathapong Suthiwongsunthorn | 2013-09-10 |
| 8304286 | Integrated circuit packaging system with shielded package and method of manufacture thereof | Reza A. Pagaila, Dioscoro A. Merilo | 2012-11-06 |
| 8258010 | Making a semiconductor device having conductive through organic vias | Reza A. Pagaila, Byung Tai Do | 2012-09-04 |
| 8193034 | Semiconductor device and method of forming vertical interconnect structure using stud bumps | Reza A. Pagaila, Byung Tai Do, Rajendra D. Pendse | 2012-06-05 |
| 8133762 | Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core | Reza A. Pagaila, Byung Tai Do | 2012-03-13 |
| 8093151 | Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the die | Reza A. Pagaila, Byung Tai Do, Nathapong Suthiwongsunthorn, Dioscoro A. Merilo | 2012-01-10 |
| 8017515 | Semiconductor device and method of forming compliant polymer layer between UBM and conformal dielectric layer/RDL for stress relief | Pandi C. Marimuthu, Nathapong Suthiwongsunthorn | 2011-09-13 |