Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12271813 | Method for determining optimal number of submodules for use in semiconductor manufacturing apparatus including substrate processing module including plurality of submodules, and semiconductor manufacturing apparatus | — | 2025-04-08 |
| 12221714 | Plating method and plating apparatus | Masashi Shimoyama, Mizuki Nagai | 2025-02-11 |
| 12191178 | Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatus | Jumpei Fujikata, Yuji Araki, Tensei Sato | 2025-01-07 |
| 12054841 | Apparatus for plating and method of plating | Kazuma Ideguchi, Hideki Wakabayashi | 2024-08-06 |
| 11461647 | Method of constructing prediction model that predicts number of plateable substrates, method of constructing selection model for predicting component that causes failure, and method of predicting number of plateable substrates | Kunio Oishi, Masashi Shimoyama | 2022-10-04 |
| 11315812 | Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatus | Jumpei Fujikata, Yuji Araki, Tensei Sato | 2022-04-26 |
| 11286577 | Plating method and plating apparatus | Masashi Shimoyama, Mizuki Nagai | 2022-03-29 |
| 11098414 | Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method | Takashi Mitsuya, Toshio Yokoyama, Masashi Shimoyama, Kunio Oishi | 2021-08-24 |
| 11099546 | Scheduler, substrate processing apparatus, and substrate conveyance method | Koji Nonobe, Takashi Mitsuya, Kunio Oishi | 2021-08-24 |
| 10824135 | Scheduler, substrate processing apparatus, and substrate conveyance method | Koji Nonobe, Takashi Mitsuya, Kunio Oishi | 2020-11-03 |
| 10824138 | Scheduler, substrate processing apparatus, and substrate conveyance method | Koji Nonobe, Takashi Mitsuya, Kunio Oishi | 2020-11-03 |
| 10818527 | Substrate holding member, substrate processing device, method for controlling substrate processing device, and storage medium storing programs | — | 2020-10-27 |
| 10648099 | Plating method and plating apparatus | Masashi Shimoyama, Mizuki Nagai | 2020-05-12 |
| 10501862 | Plating system, a plating system control method, and a storage medium containing a program for causing a computer to execute the plating system control method | Takashi Mitsuya, Toshio Yokoyama, Masashi Shimoyama, Kunio Oishi | 2019-12-10 |
| 10446422 | Method of controlling display of operation of semiconductor manufacturing apparatus and non-transitory computer readable storage medium therefor, and system for performing display concerning operation of semiconductor manufacturing apparatus | Masayuki Fujiki, Hideharu Aoyama | 2019-10-15 |
| 10077504 | Plating apparatus | Yoshio Minami | 2018-09-18 |
| 9624594 | Plating apparatus | Yoshio Minami | 2017-04-18 |
| 8655472 | Scheduler, substrate processing apparatus, and method of transferring substrates in substrate processing apparatus | Kunio Oishi, Yoichi Kobayashi | 2014-02-18 |