| 10176859 |
Non-volatile transistor element including a buried ferroelectric material based storage mechanism |
Stefan Duenkel, Ralf Richter, Soeren Jansen |
2019-01-08 |
| 10056376 |
Ferroelectric FinFET |
Stefan Flachowsky, Jan Hoentschel |
2018-08-21 |
| 9966466 |
Semiconductor-on-insulator wafer, semiconductor structure including a transistor, and methods for the formation and operation thereof |
Stefan Flachowsky |
2018-05-08 |
| 9899417 |
Semiconductor structure including a first transistor and a second transistor |
Stefan Flachowsky |
2018-02-20 |
| 9685457 |
Method including a formation of a transistor and semiconductor structure including a first transistor and a second transistor |
Stefan Flachowsky |
2017-06-20 |
| 9583240 |
Temperature independent resistor |
Stefan Flachowsky, Jan Hoentschel |
2017-02-28 |
| 9449972 |
Ferroelectric FinFET |
Stefan Flachowsky, Jan Hoentschel |
2016-09-20 |
| 9269714 |
Device including a transistor having a stressed channel region and method for the formation thereof |
Stefan Flachowsky, Gerd Zschaezsch |
2016-02-23 |
| 9224840 |
Replacement gate FinFET structures with high mobility channel |
Stefan Flachowsky, Jan Hoentschel |
2015-12-29 |
| 9023713 |
Ultrathin body fully depleted silicon-on-insulator integrated circuits and methods for fabricating same |
Stefan Flachowsky |
2015-05-05 |
| 9012277 |
In situ doping and diffusionless annealing of embedded stressor regions in PMOS and NMOS devices |
Stefan Flachowsky |
2015-04-21 |
| 8941187 |
Strain engineering in three-dimensional transistors based on strained isolation material |
Tim Baldauf, Andy Wei, Tom Herrmann, Stefan Flachowsky |
2015-01-27 |
| 8916928 |
Threshold voltage adjustment in a fin transistor by corner implantation |
Tim Baldauf, Andy Wei, Tom Herrmann, Stefan Flachowsky |
2014-12-23 |
| 8912606 |
Integrated circuits having protruding source and drain regions and methods for forming integrated circuits |
Tim Baldauf, Tom Herrmann, Stefan Flachowsky |
2014-12-16 |
| 8835255 |
Method of forming a semiconductor structure including a vertical nanowire |
Tim Baldauf, Stefan Flachowsky, Tom HERMANN |
2014-09-16 |
| 8835936 |
Source and drain doping using doped raised source and drain regions |
Jan Hoentschel, Stefan Flachowsky |
2014-09-16 |
| 8753969 |
Methods for fabricating MOS devices with stress memorization |
Stefan Flachowsky |
2014-06-17 |
| 8647951 |
Implantation of hydrogen to improve gate insulation layer-substrate interface |
Stefan Flachowsky, Jan Hoentschel |
2014-02-11 |
| 8580643 |
Threshold voltage adjustment in a Fin transistor by corner implantation |
Tim Baldauf, Andy Wei, Tom Herrmann, Stefan Flachowsky |
2013-11-12 |
| 8536034 |
Methods of forming stressed silicon-carbon areas in an NMOS transistor |
Stefan Flachowsky, Thilo Scheiper, Jan Hoentschel |
2013-09-17 |
| 8476131 |
Methods of forming a semiconductor device with recessed source/design regions, and a semiconductor device comprising same |
Stefan Flachowsky, Thilo Scheiper, Ricardo P. Mikalo |
2013-07-02 |
| 8466018 |
Methods of forming a PMOS device with in situ doped epitaxial source/drain regions |
Stefan Flachowsky, Ina Ostermay |
2013-06-18 |
| 8338885 |
Technique for enhancing dopant profile and channel conductivity by millisecond anneal processes |
Jan Hoentschel, Thomas Feudel |
2012-12-25 |
| 8143133 |
Technique for enhancing dopant profile and channel conductivity by millisecond anneal processes |
Jan Hoentschel, Thomas Feudel |
2012-03-27 |