Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132002 | Bridge interconnection with layered interconnect structures | Yueli Liu, Amanda E. Schuckman, Rui Zhang | 2024-10-29 |
| 11694960 | Bridge interconnection with layered interconnect structures | Yueli Liu, Amanda E. Schuckman, Rui Zhang | 2023-07-04 |
| 11166379 | Integrated circuit package substrate | — | 2021-11-02 |
| 11133257 | Bridge interconnection with layered interconnect structures | Yueli Liu, Amanda E. Schuckman, Rui Zhang | 2021-09-28 |
| 10770387 | Integrated circuit package substrate | Stefanie M. Lotz | 2020-09-08 |
| 10475745 | Bridge interconnection with layered interconnect structures | Yueli Liu, Amanda E. Schuckman, Rui Zhang | 2019-11-12 |
| 10390438 | Integrated circuit package substrate | — | 2019-08-20 |
| 10325843 | Integrated circuit package substrate | Stefanie M. Lotz | 2019-06-18 |
| 10103103 | Bridge interconnection with layered interconnect structures | Yueli Liu, Amanda E. Schuckman, Rui Zhang | 2018-10-16 |
| 9832883 | Integrated circuit package substrate | — | 2017-11-28 |
| 9831169 | Integrated circuit package substrate | Stefanie M. Lotz | 2017-11-28 |
| 9735120 | Low z-height package assembly | Sri Ranga Sai Boyapati | 2017-08-15 |
| 9640485 | Bridge interconnection with layered interconnect structures | Yueli Liu, Amanda E. Schuckman, Rui Zhang | 2017-05-02 |
| 9508636 | Integrated circuit package substrate | Stefanie M. Lotz | 2016-11-29 |
| 9502336 | Coreless substrate with passive device pads | Yueli Liu | 2016-11-22 |
| 9449923 | Methods of forming substrate microvias with anchor structures | Sri Ranga Sai Boyapati | 2016-09-20 |
| 9299602 | Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) package | Tao Wu, Mark S. Hlad, Charavana K. Gurumurthy | 2016-03-29 |
| 9245795 | Methods of forming substrate microvias with anchor structures | Sri Ranga Sai Boyapati | 2016-01-26 |
| 9202803 | Laser cavity formation for embedded dies or components in substrate build-up layers | Chong Zhang, Stefanie M. Lotz, Sri Ranga Sai Boyapati, Nikhil Sharma, Islam A. Salama | 2015-12-01 |
| 9147663 | Bridge interconnection with layered interconnect structures | Yueli Liu, Amanda E. Schuckman, Rui Zhang | 2015-09-29 |
| 9147638 | Interconnect structures for embedded bridge | Yueli Liu, Chong Zhang | 2015-09-29 |