Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7408264 | SMT passive device noflow underfill methodology and structure | Clement Fortin, Son K. Tran, Michael B. Vincent | 2008-08-05 |
| 7119003 | Extension of fatigue life for C4 solder ball to chip connection | William E. Bernier, Charles F. Carey, Eberhard Gramatzki, Thomas R. Homa, Eric A. Johnson +3 more | 2006-10-10 |
| 7109592 | SMT passive device noflow underfill methodology and structure | Clement Fortin, Son K. Tran, Michael B. Vincent | 2006-09-19 |
| 7067916 | Extension of fatigue life for C4 solder ball to chip connection | William E. Bernier, Charles F. Carey, Eberhard Gramatzki, Thomas R. Homa, Eric A. Johnson +3 more | 2006-06-27 |
| 6904673 | Control of flux by ink stop line in chip joining | Claude Blais, Julie Nadeau Filteau, Robert L. Toutant, Alain Warren | 2005-06-14 |
| 6739497 | SMT passive device noflow underfill methodology and structure | Clement Fortin, Son K. Tran, Michael B. Vincent | 2004-05-25 |
| 5554260 | Method and use involving naphthalene sulphonate salt(s) and polyethylene oxide, to improve retention and drainage | Georges Radu | 1996-09-10 |