Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6226187 | Integrated circuit package | David L. Questad, Anne Marie Quinn, George H. Thiel, Donna Jean Trevitt, Tien Y. Wu | 2001-05-01 |
| 6084299 | Integrated circuit package including a heat sink and an adhesive | David L. Questad, Anne Marie Quinn, George H. Thiel, Donna Jean Trevitt, Tien Y. Wu | 2000-07-04 |
| 6046911 | Dual substrate package assembly having dielectric member engaging contacts at only three locations | David W. Dranchak, Robert Kelleher, David P. Pagnani | 2000-04-04 |
| 5953214 | Dual substrate package assembly coupled to a conducting member | David W. Dranchak, Robert Kelleher, David P. Pagnani | 1999-09-14 |
| 5378306 | Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof | Michael J. Cibulsky, Konstantinos I. Papathomas, William J. Summa, David W. Wang | 1995-01-03 |
| 5288542 | Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof | Michael J. Cibulsky, Konstantinos I. Papathomas, William J. Summa, David W. Wang | 1994-02-22 |