| 12255168 |
Electronic device with multi-layer contact and system |
Alexander Heinrich, Michael Juerss, Konrad Roesl, Kok Chai Goh, Tobias Schmidt |
2025-03-18 |
| 11842975 |
Electronic device with multi-layer contact and system |
Alexander Heinrich, Michael Juerss, Konrad Roesl, Kok Chai Goh, Tobias Schmidt |
2023-12-12 |
| 10930614 |
Chip arrangements |
Manfred Mengel, Alexander Heinrich, Steffen ORSO, Thomas Behrens, Lim Fong +2 more |
2021-02-23 |
| 10475761 |
Method for producing electronic device with multi-layer contact |
Alexander Heinrich, Michael Juerss, Konrad Roesl, Kok Chai Goh, Tobias Schmidt |
2019-11-12 |
| 9735126 |
Solder alloys and arrangements |
Manfred Mengel, Alexander Heinrich, Steffen ORSO, Thomas Behrens, Lim Fong +2 more |
2017-08-15 |
| 9490193 |
Electronic device with multi-layer contact |
Alexander Heinrich, Michael Juerss, Konrad Roesl, Kok Chai Goh, Tobias Schmidt |
2016-11-08 |
| 9034751 |
Method for mounting a semiconductor chip on a carrier |
Alexander Heinrich, Konrad Roesl |
2015-05-19 |
| 8802553 |
Method for mounting a semiconductor chip on a carrier |
Alexander Heinrich, Konrad Roesl |
2014-08-12 |
| 8531014 |
Method and system for minimizing carrier stress of a semiconductor device |
Manfred Mengel, Khalil Hosseini, Joachim Mahler |
2013-09-10 |
