| 11830845 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2023-11-28 |
| 11424211 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2022-08-23 |
| 10833044 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2020-11-10 |
| 10593643 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2020-03-17 |
| 10062661 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2018-08-28 |
| 9716075 |
Semiconductor chip assembly and method for making same |
Teck-Gyu Kang, Wei-Shun Wang, Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira +3 more |
2017-07-25 |
| 9691731 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2017-06-27 |
| 9337165 |
Method for manufacturing a fan-out WLP with package |
Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Belgacem Haba, Ilyas Mohammed +1 more |
2016-05-10 |
| 9224717 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2015-12-29 |
| 9137903 |
Semiconductor chip assembly and method for making same |
Teck-Gyu Kang, Wei-Shun Wang, Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira +3 more |
2015-09-15 |
| 9093435 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2015-07-28 |
| 8957520 |
Microelectronic assembly comprising dielectric structures with different young modulus and having reduced mechanical stresses between the device terminals and external contacts |
Hiroaki Sato, Yukio Hashimoto, Yoshikuni Nakadaira, Belgacem Haba, Ilyas Mohammed +1 more |
2015-02-17 |
| 8890304 |
Fan-out microelectronic unit WLP having interconnects comprising a matrix of a high melting point, a low melting point and a polymer material |
Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Belgacem Haba, Ilyas Mohammed +1 more |
2014-11-18 |
| 8859420 |
Structure and method of making interconnect element, and multilayer wiring board including the interconnect element |
Kimitaka Endo, Tomokazu Shimada |
2014-10-14 |
| 8786070 |
Microelectronic package with stacked microelectronic elements and method for manufacture thereof |
Hiroaki Sato, Belgacem Haba, Ilyas Mohammed |
2014-07-22 |
| 8618659 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Wei-Shun Wang +6 more |
2013-12-31 |
| 8525338 |
Chip with sintered connections to package |
Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Belgacem Haba, Ilyas Mohammed +1 more |
2013-09-03 |
| 8487421 |
Microelectronic package with stacked microelectronic elements and method for manufacture thereof |
Hiroaki Sato, Belgacem Haba, Ilyas Mohammed |
2013-07-16 |
| 7923828 |
Structure and method of making interconnect element, and multilayer wiring board including the interconnect element |
Kimitaka Endo, Tomokazu Shimada |
2011-04-12 |