Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347534 | Variable stealth laser dicing process | Martin Lapke, Hartmut Buenning, Sascha Moeller, Guido Albermann, Leo M. Higgins, III | 2019-07-09 |
| 8895363 | Die preparation for wafer-level chip scale package (WLCSP) | Hartmut Buenning, Sascha Moeller, Guido Albermann, Thomas Rohleder | 2014-11-25 |