| 10014279 |
Methods of forming 3-D integrated semiconductor devices having intermediate heat spreading capabilities |
Thomas Werner, Frank Feustel |
2018-07-03 |
| 9318468 |
3-D integrated semiconductor device comprising intermediate heat spreading capabilities |
Thomas Werner, Frank Feustel |
2016-04-19 |
| 8920027 |
Assessing thermal mechanical characteristics of complex semiconductor devices by integrated heating systems |
Matthias Lehr, Frank Kuechenmeister, Steffen Koch |
2014-12-30 |
| 8598714 |
Semiconductor device comprising through hole vias having a stress relaxation mechanism |
Torsten Huisinga, Jens Hahn |
2013-12-03 |
| 8501545 |
Reduction of mechanical stress in metal stacks of sophisticated semiconductor devices during die-substrate soldering by an enhanced cool down regime |
Matthias Lehr, Rainer Giedigkeit |
2013-08-06 |
| 8497583 |
Stress reduction in chip packaging by a stress compensation region formed around the chip |
Dmytro Chumakov, Heike Berthold, Katrin Reiche |
2013-07-30 |
| 8482123 |
Stress reduction in chip packaging by using a low-temperature chip-package connection regime |
Matthias Lehr, Thomas Werner |
2013-07-09 |
| 8479578 |
Assessing metal stack integrity in sophisticated semiconductor devices by mechanically stressing die contacts |
Holm Geisler, Matthias Lehr, Frank Kuechenmeister |
2013-07-09 |
| 8399335 |
Sophisticated metallization systems in semiconductors formed by removing damaged dielectric layers after forming the metal features |
Torsten Huisinga, Frank Feustel |
2013-03-19 |
| 8357610 |
Reducing patterning variability of trenches in metallization layer stacks with a low-k material by reducing contamination of trench dielectrics |
Frank Feustel, Thomas Werner, Kai Frohberg |
2013-01-22 |
| 8080866 |
3-D integrated semiconductor device comprising intermediate heat spreading capabilities |
Thomas Werner, Frank Feustel |
2011-12-20 |
| 7982313 |
Semiconductor device including stress relaxation gaps for enhancing chip package interaction stability |
Matthias Lehr |
2011-07-19 |
| 7829357 |
Method and test structure for monitoring CMP processes in metallization layers of semiconductor devices |
Matthias Lehr |
2010-11-09 |
