Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10347534 | Variable stealth laser dicing process | Hartmut Buenning, Sascha Moeller, Guido Albermann, Michael Zernack, Leo M. Higgins, III | 2019-07-09 |
| 9847258 | Plasma dicing with blade saw patterned underside mask | Thomas Rohleder, Hartmut Buenning, Guido Albermann, Sascha Moeller | 2017-12-19 |
| 9812361 | Combination grinding after laser (GAL) and laser on-off function to increase die strength | Hartmut Buenning, Sascha Moeller, Guido Albermann, Thomas Rohleder | 2017-11-07 |
| 9601437 | Plasma etching and stealth dicing laser process | Guido Albermann, Sascha Moeller, Thomas Rohleder, Hartmut Buenning | 2017-03-21 |
| 9349645 | Apparatus, device and method for wafer dicing | Hartmut Buenning, Sascha Moeller, Guido Albermann, Thomas Rohleder, Heiko Backer | 2016-05-24 |
| 9113543 | Device and use of the device for measuring the density and/or the electron temperature and/or the collision frequency of a plasma | Ralf Brinkmann, Jens Oberrath, Peter Awakowicz, Thomas Musch, Thomas Mussenbrock +5 more | 2015-08-18 |
| 8809166 | High die strength semiconductor wafer processing method and system | Hartmut Buenning, Sascha Moeller, Guido Albermann, Thomas Rohleder | 2014-08-19 |