Issued Patents All Time
Showing 1–25 of 119 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381119 | Seal for microelectronic assembly | Rajesh Katkar, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao, Ilyas Mohammed | 2025-08-05 |
| 12374656 | Multi-chip modules formed using wafer-level processing of a reconstituted wafer | Rajesh Katkar | 2025-07-29 |
| 12322667 | Seal for microelectronic assembly | Rajesh Katkar, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao, Ilyas Mohammed | 2025-06-03 |
| 12271032 | Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects | Shaowu Huang, Javier A. Delacruz, Guilian Gao | 2025-04-08 |
| 12199082 | Method of direct-bonded optoelectronic devices | Min Tao, Rajesh Katkar, Cyprian Emeka Uzoh | 2025-01-14 |
| 12166024 | Direct-bonded LED arrays drivers | Min Tao, Rajesh Katkar, Cyprian Emeka Uzoh | 2024-12-10 |
| 12100684 | Bonded structures | Rajesh Katkar, Javier A. Delacruz, Arkalgud R. Sitaram | 2024-09-24 |
| 12046571 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Rajesh Katkar, Guilian Gao, Laura Wills Mirkarimi | 2024-07-23 |
| 11967575 | Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes | Guilian Gao, Javier A. Delacruz, Shaowu Huang, Gaius Gillman Fountain, Jr., Rajesh Katkar +1 more | 2024-04-23 |
| 11948847 | Bonded structures | Rajesh Katkar | 2024-04-02 |
| 11860415 | Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects | Shaowu Huang, Javier A. Delacruz, Guilian Gao | 2024-01-02 |
| 11715730 | Direct-bonded LED arrays including optical elements configured to transmit optical signals from LED elements | Min Tao, Rajesh Katkar, Cyprian Emeka Uzoh | 2023-08-01 |
| 11670615 | Bonded structures | Rajesh Katkar, Javier A. Delacruz, Arkalgud R. Sitaram | 2023-06-06 |
| 11600542 | Cavity packages | Shaowu Huang, Javier A. Delacruz, Rajesh Katkar, Belgacem Haba | 2023-03-07 |
| 11515279 | Low temperature bonded structures | Cyprian Emeka Uzoh, Jeremy Alfred Theil, Rajesh Katkar, Guilian Gao, Laura Wills Mirkarimi | 2022-11-29 |
| 11417576 | Seal for microelectronic assembly | Rajesh Katkar, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao, Ilyas Mohammed | 2022-08-16 |
| 11387214 | Multi-chip modules formed using wafer-level processing of a reconstituted wafer | Rajesh Katkar | 2022-07-12 |
| 11380597 | Bonded structures | Rajesh Katkar | 2022-07-05 |
| 11329034 | Direct-bonded LED structure contacts and substrate contacts | Min Tao, Rajesh Katkar, Cyprian Emeka Uzoh | 2022-05-10 |
| 11296044 | Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes | Guilian Gao, Javier A. Delacruz, Shaowu Huang, Gaius Gillman Fountain, Jr., Rajesh Katkar +1 more | 2022-04-05 |
| 11257727 | Seal for microelectronic assembly | Rajesh Katkar, Cyprian Emeka Uzoh, Shaowu Huang, Guilian Gao, Ilyas Mohammed | 2022-02-22 |
| 11169326 | Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects | Shaowu Huang, Javier A. Delacruz, Guilian Gao | 2021-11-09 |
| 11114408 | System and method for providing 3D wafer assembly with known-good-dies | Hong Shen, Guilian Gao | 2021-09-07 |
| 11056390 | Structures and methods for reliable packages | Cyprian Emeka Uzoh, Guilian Gao, Hong Shen, Arkalgud R. Sitaram | 2021-07-06 |
| 11024220 | Formation of a light-emitting diode display | Rajesh Katkar, Javier A. Delacruz, Ilyas Mohammed, Belgacem Haba | 2021-06-01 |