Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7993741 | Preventing damage with separators | Klaus Hartig, Gary L. Pfaff | 2011-08-09 |
| 7829424 | Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs | Ivor G. Barber, Aritharan Thurairajaratnam | 2010-11-09 |
| 7791210 | Semiconductor package having discrete non-active electrical components incorporated into the package | Aritharan Thurairajaratnam | 2010-09-07 |
| 7508062 | Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs | Ivor G. Barber, Aritharan Thurairajaratnam | 2009-03-24 |
| 7414322 | High speed interface design | Gregory Scott Winn | 2008-08-19 |
| 7319272 | Ball assignment system | Arun Ramakrishnan, Farshad Ghahghahi, Aritharan Thurairajaratnam | 2008-01-15 |
| 7298036 | Scaling of functional assignments in packages | Jeffrey A. Hall | 2007-11-20 |
| 7267880 | Presence indicator for removable transparent film | Annette J. Krisko, Klaus Hartig, Roger O'Shaughnessy, Gary L. Pfaff | 2007-09-11 |
| 7062742 | Routing structure for transceiver core | — | 2006-06-13 |
| 7051434 | Designing a ball assignment for a ball grid array package | Farshad Ghahghahi | 2006-05-30 |
| 6963129 | Multi-chip package having a contiguous heat spreader assembly | Thomas R. Evans, Stan Mihelcic, Kumar Nagarajan, Edwin M. Fulcher | 2005-11-08 |
| 6858930 | Multi chip module | Kishor Desai | 2005-02-22 |
| 6791177 | Integrated circuit packaging that uses guard conductors to isolate noise-sensitive signals within the package substrate | Aritharan Thurairajaratnam, Edwin M. Fulcher | 2004-09-14 |
| 6768386 | Dual clock package option | — | 2004-07-27 |
| 6762366 | Ball assignment for ball grid array package | Farshad Ghahghahi, Edwin M. Fulcher | 2004-07-13 |
| 6744130 | Isolated stripline structure | Aritharan Thurairajaratnam, Edwin M. Fulcher | 2004-06-01 |
| 6701270 | Method for reliability testing leakage characteristics in an electronic circuit and a testing device for accomplishing the source | Anand Govind | 2004-03-02 |
| 6680532 | Multi chip module | Kishor Desai | 2004-01-20 |
| 6534968 | Integrated circuit test vehicle | Anand Govind, Zafer Kutlu, Chao-Wen Chung, Aritharan Thurairajaratnam | 2003-03-18 |
| 6459049 | High density signal routing | Farshad Ghahghahi, Edwin M. Fulcher, Aritharan Thurairajaratnam | 2002-10-01 |
| 6445066 | Splitting and assigning power planes | — | 2002-09-03 |